公开(公告)号：US20190203983A1

公开(公告)日：2019-07-04

申请号：US15941330

申请日：2018-03-30

Applicant: LG ELECTRONICS INC.

Inventor： Yongseog JEON ,  Joongnyon KIM ,  Hyeuk CHANG

IPC: F25B21/04 ,  F28D15/04 ,  H05K7/20

CPC classification number: F25B21/04 ,  F25B2321/0252 ,  F28D15/043 ,  H01L35/28 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20336

Abstract: Disclosed is a cooling apparatus using thermoelectric modules. The cooling apparatus includes a cooling container, a first thermoelectric module contacting the cooling container at a first position, and a first heat dissipating module contacting the first thermoelectric module. The first heat dissipating module includes a loop heat pipe including a first evaporation unit contacting the first thermoelectric module and provided with a wick structure located therein, a first condensation unit located at the outside of the cooling container, a first vapor pipe line configured to interconnect one side of the first evaporation unit and one side of the first condensation unit such that gas is placed therein, and a first liquid pipe line configured to interconnect the other side of the first evaporation unit and the other side of the first condensation unit such that a working fluid is placed therein.