公开(公告)号：US20200309723A1

公开(公告)日：2020-10-01

申请号：US16669060

申请日：2019-10-30

Applicant: LG Electronics Inc.

Inventor： Jinho KIM ,  Insung HWANG ,  Seongwon BAE

IPC: G01N27/12

Abstract: A sensor module includes a sensor configured to sense gas in air, a load resistor connected to the sensor, and a processor configured to determine a gas concentration of the gas in the air based on an internal resistor of the sensor and the load resistor. The processor is configured to obtain an electrical conductivity change amount of the sensor and adjust a load resistance value of the load resistor based on the electrical conductivity change amount.

公开(公告)号：US20200158671A1

公开(公告)日：2020-05-21

申请号：US16635318

申请日：2018-03-22

Applicant: LG ELECTRONICS INC.

Inventor： Insung HWANG ,  Moosub KIM ,  Sungeun LEE ,  Sunghee LEE

IPC: G01N27/12 ,  G01N33/00

Abstract: The present disclosure relates to a gas sensor that minimizes the effects of humidity. The present disclosure relates to a gas sensor that minimizes the effects of humidity. Provided, in the present disclosure, is a gas sensor comprising: a substrate; a unit sensing unit disposed on the substrate and including a wiring electrode, a heater electrode, and a gas sensing material; a protective cap having a side wall part formed on the substrate and surrounding the unit sensing unit and a cover part disposed above the unit sensing unit and including at least one hole; and a heater unit disposed between the unit sensing unit and the cover unit, wherein the heater unit generates heat together with the heater electrode so as to lower humidity around the unit sensing unit.

公开(公告)号：US20200049645A1

公开(公告)日：2020-02-13

申请号：US16485768

申请日：2017-05-31

Applicant: LG ELECTRONICS INC.

Inventor： Moosub KIM ,  Insung HWANG

IPC: G01N27/12 ,  G01N1/24

Abstract: A dual heater gas sensor module according to an embodiment of the present invention comprises: a housing having a front side and a back side which are partially open and forming the exterior of the dual heater gas sensor module; a first gas sensor for heating the air flowing in through the front side of the housing; and a second gas sensor for measuring a specific gas contained in the air discharging through the backside of the housing, wherein the first gas sensor is located in a first region, the second gas sensor is located in a second region that is higher than the first region, and the first region and the second region may be connected by an inclined plane.

公开(公告)号：US20200041435A1

公开(公告)日：2020-02-06

申请号：US16339973

申请日：2016-11-18

Applicant: LG ELECTRONICS INC.

Inventor： Insung HWANG ,  Byungkee LEE ,  Yunguk JANG ,  Sunjung KIM

IPC: G01N27/16 ,  G01N27/12 ,  G01N25/00 ,  G01N27/30

Abstract: A sensor is disclosed. The sensor according to an embodiment of the present invention may include a substrate; a first electrode pattern disposed on one side of the substrate to form a layer; a second electrode pattern disposed on the one side of the substrate to form a layer and separated from the first electrode pattern; a sensing layer located on the one side of the substrate and covering the first electrode pattern and the second electrode pattern and containing a semiconductor; a protective layer located on the one side of the substrate and covering at least a part of the sensing layer, and containing a material different from that of the sensing layer; a first electrode pad disposed on the one side of the substrate to form a layer and electrically connected to the first electrode pattern; a second electrode pad disposed on the one side of the substrate and electrically connected to the second electrode pattern; and a housing accommodating the substrate and including a filter spaced apart from the substrate, wherein the substrate includes an opening formed adjacent to an outer boundary of the first and second electrode patterns.

公开(公告)号：US20170316995A1

公开(公告)日：2017-11-02

申请号：US15497661

申请日：2017-04-26

Applicant: LG ELECTRONICS INC.

Inventor： Insung HWANG ,  Wonhyeog JIN ,  Moosub KIM ,  Yunguk JANG

IPC: H01L23/053 ,  G01N27/12 ,  H01L23/482 ,  H01L23/00

CPC classification number: H01L23/4821 ,  G01N27/123 ,  G01N27/128 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/293 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A sensor is disclosed. The sensor comprises a first substrate; a second substrate positioned relative to the first substrate; a first electrode located between the first substrate and the second substrate, the first electrode formed on the second substrate; a sensing portion covering at least a part of the first electrode and further covering at least a portion of the second substrate; a pad electrode located between the first substrate and the second substrate, wherein the pad electrode is formed on the second substrate and is electrically coupled to the first electrode; and a bonding pad located between the first substrate and the second substrate, wherein the bonding pad is formed on the first substrate and is electrically coupled to the pad electrode.