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    Multilevel mask circuit fabrication and multilayer circuit
    5.
    发明授权
    Multilevel mask circuit fabrication and multilayer circuit 有权
    多层屏蔽电路制造和多层电路

    公开(公告)号：US09583387B2

    公开(公告)日：2017-02-28

    申请号：US14787223

    申请日：2013-04-30

    申请人： Applied Materials, Inc.

    发明人： Ping Mei ,  Carl A. Taussig ,  Marcia Almanza-Workman

    IPC分类号： H01L21/44 ,  H01L21/768 ,  G06F3/044 ,  H01L23/482 ,  H01L21/3213 ,  H01L23/528

    CPC分类号： H01L21/76886 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  H01L21/32139 ,  H01L23/4821 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Circuit fabrication uses a multilevel mask to pattern a first conductor layer of a multilayer circuit. The first conductor patterning is to provide electrical isolation between the first conductor layer and a second conductor layer that one of overlies the multilevel mask and underlies the multilevel mask. With the second conductor layer overlying the multilevel mask, the electrical isolation is provided by undercutting the multilevel mask. Alternatively, with the second conductor underlying the multilevel mask, the first conductor includes a bridged gapped conductor and the electrical isolation may be provided by both the bridged gapped conductor and an insulating layer between the second conductor layer and the first conductor layer.

    摘要翻译： 电路制造使用多层掩模来图案化多层电路的第一导体层。 第一导体图案化是在第一导体层和第二导体层之间提供电隔离，其中一个覆盖多层掩模并且在多层掩模之下。 通过覆盖多层掩模的第二导体层，通过底切多层掩模提供电隔离。 或者，利用位于多层掩模下面的第二导体，第一导体包括桥接间隙导体，并且电隔离可以由桥接间隙导体和第二导体层与第一导体层之间的绝缘层两者提供。

    Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
    8.
    发明授权
    Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion 有权
    使用具有压力调节的可逆粘合的微结构弹性体表面印刷可转印部件

    公开(公告)号：US09412727B2

    公开(公告)日：2016-08-09

    申请号：US13237375

    申请日：2011-09-20

    申请人： Etienne Menard ,  John A. Rogers ,  Seok Kim ,  Andrew Carlson

    发明人： Etienne Menard ,  John A. Rogers ,  Seok Kim ,  Andrew Carlson

    IPC分类号： B29C59/02 ,  H01L21/683 ,  H01L25/00 ,  H01L23/482

    CPC分类号： H01L21/67132 ,  B32B9/005 ,  B32B37/025 ,  B32B37/16 ,  B32B41/00 ,  B32B2313/00 ,  B32B2457/14 ,  B41F16/00 ,  H01L21/67144 ,  H01L21/6835 ,  H01L23/4821 ,  H01L25/50 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/32145 ,  H01L2224/83192

    摘要： In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

    摘要翻译： 在印刷可转印部件的方法中，包括具有从其表面突出的三维浮雕特征的弹性体柱的印模被压制在供体基板上的部件上，该第一压力足以使浮雕特征机械地变形，并且 位于浮雕特征之间的柱的区域，以在第一接触区域上接触部件。 印模从供体基板缩回，使得该部件粘附到印模上。 包括附着在其上的部件的印模被压在接受基板上，第二压力小于在小于第一接触面积的第二接触面积上接触部件的第一压力。 然后将印模从接收基板缩回以从印模分离该部件并将该部件打印到接收基板上。 还讨论了相关装置和邮票。

    Stacked interconnect structure and method of making the same
    9.
    发明授权
    Stacked interconnect structure and method of making the same 有权
    堆叠互连结构和制作方法

    公开(公告)号：US09385068B2

    公开(公告)日：2016-07-05

    申请号：US14198281

    申请日：2014-03-05

    申请人： Thomas J. Knight

    发明人： Thomas J. Knight

    IPC分类号： H01L23/482 ,  H01L21/764 ,  H01L21/768 ,  H01L23/48 ,  H01L23/522 ,  H01L23/532

    CPC分类号： H01L23/4821 ,  H01L21/764 ,  H01L21/7682 ,  H01L21/7688 ,  H01L21/76883 ,  H01L23/481 ,  H01L23/5222 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method is provided of forming an interconnect structure. The method comprises forming a first dielectric layer overlying a first conductive layer, etching a trench opening in the first dielectric layer, depositing a sacrificial material layer in the trench opening, and forming a second conductive layer overlying the sacrificial layer. The method also comprises forming a via to the sacrificial layer, and performing an etch to remove the sacrificial material layer through the via and leave a resultant air gap between the first conductive layer and the second conductive layer decreasing the effective dielectric constant between the first and second conductive layers.

    摘要翻译： 提供形成互连结构的方法。 该方法包括形成覆盖第一导电层的第一介电层，蚀刻第一介电层中的沟槽开口，在沟槽开口中沉积牺牲材料层，以及形成覆盖牺牲层的第二导电层。 该方法还包括将通孔形成到牺牲层，并且执行蚀刻以通过通孔去除牺牲材料层，并且在第一导电层和第二导电层之间留下合成的气隙，从而降低第一和第二导电层之间的有效介电常数 第二导电层。

    AIR BRIDGE STRUCTURE HAVING DIELECTRIC COATING
    10.
    发明申请
    AIR BRIDGE STRUCTURE HAVING DIELECTRIC COATING 有权
    具有电介质涂层的空气桥结构

    公开(公告)号：US20160071809A1

    公开(公告)日：2016-03-10

    申请号：US14941161

    申请日：2015-11-13

    申请人： Raytheon Company

    发明人： Ward G. Fillmore ,  Paul J. Duval

    IPC分类号： H01L23/00 ,  H01L23/482 ,  H01L23/66 ,  H01L21/768

    CPC分类号： H01L23/562 ,  H01L21/764 ,  H01L21/7682 ,  H01L23/4821 ,  H01L23/4824 ,  H01L23/66 ,  H01L2223/6683 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A substrate having an air bridge structure with end portions disposed and supported on the substrate and an elevated portion disposed between the end portions is coated with a protective layer. The protective layer is patterned to: leave portions of the protective layer over elevated portion and at least over the end portions of a region under the elevated portion of the air bridge structure; and remove portions over adjacent portions of the substrate. A dielectric material having a thickness greater than the height of the air bridge structure is deposited over the patterned protective layer portions remaining over elevated portion and over the adjacent portions of the substrate, the patterned temporary coating preventing the to dielectric material from passing into the region under the elevated portion of the air bridge structure. The dielectric material is patterned to remove portions of the dielectric material over the patterned protective layer remaining over elevated portion while leaving the dielectric material over the adjacent portions of the substrate. The patterned protective layer portions remaining over elevated portion are removed while leaving the dielectric material over the adjacent portions of the substrate.

    摘要翻译： 具有空气桥结构的基板，其端部设置并支撑在基板上，并且设置在端部之间的升高部分被涂覆有保护层。 保护层被图案化：将保护层的部分留在升高的部分上，并至少超过空气桥结构的升高部分下方的区域的端部; 并且去除衬底的相邻部分上的部分。 具有大于空气桥结构高度的厚度的电介质材料沉积在保留在升高部分上方的图案化保护层部分上并在基底的相邻部分之上，图案化的临时涂层防止介电材料进入该区域 在空气桥结构的升高部分下。 将电介质材料图案化以除去保留在升高部分上的图案化保护层上的电介质材料的部分，同时将电介质材料留在衬底的相邻部分上。 除去保留在升高部分上的图案化保护层部分，同时将电介质材料留在衬底的相邻部分上。