CHIP DISPENSER FOR SELF-ASSEMBLY
    1.
    发明公开

    公开(公告)号:US20230163007A1

    公开(公告)日:2023-05-25

    申请号:US17799111

    申请日:2020-02-19

    CPC classification number: H01L21/67721 H01L33/005 H01L21/67333

    Abstract: The present invention relates to a method of manufacturing a display device, and more particularly, to a chip dispenser for supplying a micro-LED. The present invention provides a chip dispenser including a body part for accommodating the fluid and the semiconductor light emitting device, and discharging the accommodated fluid and the semiconductor light emitting device, a pressure controller for varying the pressure inside the body; and a stirring part disposed in at least one of the inside and outside of the body, agitating the fluid accommodated in the body and the pressure controller increases the internal pressure of the body part so that the fluid and the semiconductor light emitting device are discharged to the outside in a state in which the agitating part stirs the fluid.

    MOLD ASSEMBLY FOR INJECTION MOLDING
    2.
    发明申请

    公开(公告)号:US20190030770A1

    公开(公告)日:2019-01-31

    申请号:US16073055

    申请日:2017-01-19

    Abstract: Disclosed is a mold assembly comprising: a cavity forming an inner space to be filled with resin containing metallic particles, and having a protruding part corresponding to a hole of a molded object; a first gate disposed at any one side of the cavity so as to inject the resin into the inner space; and a second gate disposed at another side of the cavity, and injecting the resin, which flows in a second direction intersecting with a first direction, into the inner space so as to change the arrangement of the metallic particles such that a weld line, formed according to the orientation of metallic particle in the first direction, is blurred in an area at which the flow of the resin is separated by the protruding part and then comes back together.

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