公开(公告)号：US20130122812A1

公开(公告)日：2013-05-16

申请号：US13676767

申请日：2012-11-14

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Hyun CHOI

IPC: H04M1/60

CPC classification number: H04M1/6041 ,  H04M1/6066 ,  H04R3/02 ,  H04R3/04 ,  H04R2420/07

Abstract: Disclosed are a short range wireless communication apparatus and a method for improving phone sound quality. The short range wireless communication apparatus a microphone to receive a phone voice to output an audio signal, an equalizer to compensate the audio signal output from the microphone for signal distortion according to a frequency response characteristic of a terminal, and a wireless communication unit to transmit the compensated audio signal to the terminal.

Abstract translation: 公开了一种短距离无线通信装置和用于提高电话音质的方法。 短距离无线通信装置，用于接收电话语音以输出音频信号的麦克风，均衡器，用于根据终端的频率响应特性补偿从麦克风输出的用于信号失真的音频信号;以及无线通信单元，用于发送 补偿音频信号到终端。

公开(公告)号：US20250006715A1

公开(公告)日：2025-01-02

申请号：US18703592

申请日：2022-11-15

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Hyun CHOI

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/367 ,  H01L23/538

Abstract: An SiP module according to an embodiment of the present invention comprises: a substrate; a first integrated chip (IC) embedded in the substrate; and a second IC disposed on one surface of the substrate, wherein the first IC and the second IC are disposed such that at least portions thereof overlap with respect to a first direction extending through the one surface of the substrate and the other surface thereof.

公开(公告)号：US20240162266A1

公开(公告)日：2024-05-16

申请号：US18282893

申请日：2022-04-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Hyun CHOI

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/36 ,  H01L23/498

CPC classification number: H01L27/14634 ,  H01L23/36 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A SiP module according to the embodiment comprises: a substrate; an image sensor disposed on one surface of the substrate; and a serializer embedded inside the substrate. The substrate includes a via hole that penetrates through the substrate in order to electrically connect the image sensor and the serializer.