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公开(公告)号：US20170019992A1
公开(公告)日：2017-01-19
申请号：US14831674
申请日：2015-08-20
申请人： LG INNOTEK CO., LTD.
发明人： Yun Mi BAE , Soon Gyu KWON , Sang Hwa KIM , Sang Young LEE , Jin Hak LEE , Han Su LEE , Dong Hun JEONG , In Ho JEONG , Dae Young CHOI , Jung Ho HWANG
CPC分类号： H05K1/11 , C25D3/38 , C25D3/48 , C25D5/022 , C25D5/48 , C25D7/123 , H05K1/09 , H05K3/108 , H05K3/181 , H05K3/188 , H05K3/244 , H05K2201/0338 , H05K2201/098 , H05K2201/0989 , H05K2201/099 , H05K2203/1184
摘要： A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
摘要翻译： 印刷电路板包括绝缘层，绝缘层上的电路图案和电路图案上的表面处理层。 表面处理层包括具有比电路图案的顶表面的宽度宽的宽度的底表面。
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公开(公告)号：US20230337370A1
公开(公告)日：2023-10-19
申请号：US18337706
申请日：2023-06-20
申请人： LG INNOTEK CO., LTD.
发明人： Yun Mi BAE , Soon Gyu KWON , Sang Hwa KIM , Sang Young LEE , Jin Hak LEE , Han Su LEE , Dong Hun JEONG , In Ho JEONG , Dae Young CHOI , Jung Ho HWANG
IPC分类号： H05K3/24 , H05K3/10 , C25D5/48 , H05K3/18 , H05K1/09 , C25D7/12 , H05K1/02 , C25D3/48 , C25D5/02 , H05K1/11 , C25D3/38
CPC分类号： H05K3/244 , H05K3/108 , C25D5/48 , H05K3/181 , H05K1/09 , C25D7/123 , H05K1/0296 , C25D3/48 , H05K3/188 , C25D5/022 , H05K1/11 , H05K2201/0989 , C25D3/38 , H05K2201/0338 , H05K2201/099 , H05K2201/098 , H05K2203/1184
摘要： A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
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公开(公告)号：US20210120677A1
公开(公告)日：2021-04-22
申请号：US17135223
申请日：2020-12-28
申请人： LG INNOTEK CO., LTD.
发明人： Jung Ho HWANG , Han Su LEE , Dae Young CHOI , Soon Gyu KWON , Dong Hun JEONG , In Ho JEONG , Kil Dong SON , Sang Hwa KIM , Sang Young LEE , Jae Hoon JEON , Jin Hak LEE , Yun Mi BAE
摘要： A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
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公开(公告)号：US20180332714A1
公开(公告)日：2018-11-15
申请号：US15878701
申请日：2018-01-24
申请人： LG INNOTEK CO., LTD.
发明人： Yun Mi BAE , Soon Gyu KWON , Sang Hwa KIM , Sang Young LEE , Jin Hak LEE , Han Su LEE , Dong Hun JEONG , In Ho JEONG , Dae Young CHOI , Jung Ho HWANG
CPC分类号： H05K3/244 , C25D3/38 , C25D3/48 , C25D5/022 , C25D5/48 , C25D7/123 , H05K1/09 , H05K1/11 , H05K3/108 , H05K3/181 , H05K3/188 , H05K2201/0338 , H05K2201/098 , H05K2201/0989 , H05K2201/099 , H05K2203/1184
摘要： A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein the circuit pattern layer includes a corner portion of an upper portion which has a curvature, and wherein the corner portion of the circuit pattern layer is a boundary surface between the top surface and a side surface of the circuit pattern layer, and the boundary surface has a concavely curved surface.
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公开(公告)号：US20170251556A1
公开(公告)日：2017-08-31
申请号：US15594778
申请日：2017-05-15
申请人： LG INNOTEK CO., LTD.
发明人： Yun Mi BAE , Soon Gyu KWON , Sang Hwa KIM , Sang Young LEE , Jin Hak LEE , Han Su LEE , Dong Hun JEONG , In Ho JEONG , Dae Young CHOI , Jung Ho HWANG
CPC分类号： H05K1/11 , C25D3/38 , C25D3/48 , C25D5/022 , C25D5/48 , C25D7/123 , H05K1/09 , H05K3/108 , H05K3/181 , H05K3/188 , H05K3/244 , H05K2201/0338 , H05K2201/098 , H05K2201/0989 , H05K2201/099 , H05K2203/1184
摘要： A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein a width of a bottom surface of the surface treatment layer is narrower than a width of a top surface of the plating seed layer, wherein the bottom surface of the surface treatment layer includes: a first portion contacted with the circuit pattern layer; and a second portion non contacted with the circuit pattern layer, and wherein a width of a top surface of the circuit pattern layer is narrower than a width of a bottom surface of the circuit pattern layer.
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公开(公告)号：US20220240390A1
公开(公告)日：2022-07-28
申请号：US17653054
申请日：2022-03-01
申请人： LG INNOTEK CO., LTD.
发明人： Yun Mi BAE , Soon Gyu KWON , Sang Hwa KIM , Sang Young LEE , Jin Hak LEE , Han Su LEE , Dong Hun JEONG , In Ho JEONG , Dae Young CHOI , Jung Ho HWANG
IPC分类号： H05K3/24 , H05K3/18 , H05K3/10 , H05K1/02 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/12 , H05K1/09 , H05K1/11
摘要： A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
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公开(公告)号：US20210243901A1
公开(公告)日：2021-08-05
申请号：US17236519
申请日：2021-04-21
申请人： LG INNOTEK CO., LTD.
发明人： Yun Mi BAE , Soon Gyu KWON , Sang Hwa KIM , Sang Young LEE , Jin Hak LEE , Han Su LEE , Dong Hun JEONG , In Ho JEONG , Dae Young CHOI , Jung Ho HWANG
IPC分类号： H05K3/24 , H05K3/18 , H05K3/10 , H05K1/02 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/12 , H05K1/09 , H05K1/11
摘要： A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
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公开(公告)号：US20200146156A1
公开(公告)日：2020-05-07
申请号：US16717679
申请日：2019-12-17
申请人： LG INNOTEK CO., LTD.
发明人： Yun Mi BAE , Soon Gyu KWON , Sang Hwa KIM , Sang Young LEE , Jin Hak LEE , Han Su LEE , Dong Hun JEONG , In Ho JEONG , Dae Young CHOI , Jung Ho HWANG
摘要： A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
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