公开(公告)号：US20200315004A1

公开(公告)日：2020-10-01

申请号：US16649913

申请日：2018-09-18

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Sik LEE ,  Jin A GU ,  Soo Jung YOON ,  Gyung Seok LEE ,  Hyun Gu IM

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/02 ,  H01L33/64 ,  H05K3/46 ,  C09C1/00 ,  C09C3/12 ,  C08K9/06 ,  C08K3/38

Abstract: A circuit board according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and comprising boron nitride agglomerate particles coated with a resin; and a second metal layer disposed on the insulating layer, wherein: one of both surfaces of the first metal layer, on which the insulating layer is disposed, is in at least partial contact with one surface of the insulating layer; one of both surfaces of the second metal layer, on which the insulating layer is disposed, is in at least partial contact with the other surface of the insulating layer; a plurality of grooves are formed on a surface which is one of both surfaces of at least one of the first metal layer and the second metal layer and which has the insulating layer disposed thereon; at least some of the particles are arranged in at least some of the plurality of grooves; the width (W) of at least one of the plurality of grooves is 1 to 1.8 times D50 of the particles; and a ratio (D/W) of the depth (D) to the width (W) of at least one of the plurality of grooves is 0.2 to 0.3.