公开(公告)号：US20140251976A1

公开(公告)日：2014-09-11

申请号：US14353199

申请日：2012-10-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Ick Chan KIM ,  Moo Seong KIM

IPC: H01L21/67 ,  C23C26/00

CPC classification number: C23C26/00 ,  C23C16/4581 ,  H01L21/67103

Abstract: Disclosed are a hot plate and a method of manufacturing the same. The method includes the steps of preparing a first barrier layer, laminating a first heat transfer layer on the first barrier layer, and laminating a second barrier layer on the first heat transfer layer. The first barrier layer or the second barrier layer includes a plurality of first sub-nano-barrier layers and a plurality of second sub-nano-barrier layers. The hot plate includes a first barrier layer, a first heat transfer layer on the first barrier layer, and a second barrier layer on the first heat transfer layer. The first barrier layer or the second barrier layer includes a plurality of first sub-nano-barrier layers and a plurality of second sub-nano-barrier layers.

Abstract translation: 公开了一种热板及其制造方法。 该方法包括以下步骤：制备第一阻挡层，在第一阻挡层上层叠第一传热层，以及在第一传热层上层压第二阻挡层。 第一阻挡层或第二阻挡层包括多个第一亚纳米阻挡层和多个第二亚纳米阻挡层。 热板包括第一阻挡层，第一阻挡层上的第一传热层和第一传热层上的第二阻挡层。 第一阻挡层或第二阻挡层包括多个第一亚纳米阻挡层和多个第二亚纳米阻挡层。