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    CIRCUIT BOARD
    1.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20230240005A1

    公开(公告)日：2023-07-27

    申请号：US17928703

    申请日：2021-06-10

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk KIM ,  Jeong Han KIM ,  Moo Seong KIM

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0296 ,  H05K1/115

    Abstract: A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.

    CIRCUIT BOARD
    3.
    发明申请
    CIRCUIT BOARD 有权

    公开(公告)号：US20220151068A1

    公开(公告)日：2022-05-12

    申请号：US17430708

    申请日：2020-02-10

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Min Young HWANG ,  Moo Seong KIM ,  Byeong Kyun CHOI

    IPC: H05K1/11 ,  H05K1/02

    Abstract: A circuit board according to one embodiment comprises a first insulation layer, a circuit pattern on the first insulation layer, and a second insulation layer on the circuit pattern, wherein a heat transfer member is arranged inside the first insulation layer and/or the second insulation layer, and the heat transfer member is arranged while coming in contact with a side surface of the insulation layer.

    CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
    4.
    发明公开
    CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME 审中-公开

    公开(公告)号：US20240120243A1

    公开(公告)日：2024-04-11

    申请号：US18263603

    申请日：2021-04-26

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Bae SHIN ,  Moo Seong KIM ,  Soo Min LEE ,  Jae Hun JEONG

    IPC: H01L23/13 ,  H01L21/48 ,  H01L23/498 ,  H05K1/18 ,  H05K3/46

    CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H05K1/183 ,  H05K3/4644 ,  H05K2203/0195

    Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a plurality of pads disposed on the first insulating layer and having top surfaces exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than a top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall is perpendicular to top or bottom surface of the second insulating layer, wherein the bottom surface of the cavity includes: a first bottom surface positioned lower than a top surface of the pad and positioned outside an arrangement region of the plurality of pads; and a second bottom surface positioned lower than the top surface of the pad and positioned inside the arrangement region of the plurality of pads, and wherein a height of the first bottom surface is different from a height of the second bottom surface.

    CIRCUIT BOARD
    5.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20230300977A1

    公开(公告)日：2023-09-21

    申请号：US18009453

    申请日：2021-06-11

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Se Woong NA ,  Jung Eun HAN ,  Moo Seong KIM

    IPC: H05K1/02 ,  H05K3/28

    CPC classification number: H05K1/0298 ,  H05K3/28

    Abstract: A circuit board according to an embodiment includes: an insulating layer including first to third regions; an outer layer circuit pattern disposed on an upper surface of the first to third regions of the insulating layer; and a solder resist including a first part disposed on the first region of the insulating layer, a second part disposed on the second region, and a third part disposed on the third region, wherein the outer layer circuit pattern includes: a first trace disposed on an upper surface of the first region of the insulating layer; and a second trace disposed on an upper surface of the third region of the insulating layer; wherein a height of the first trace is different from a height of the second trace; and an upper surface of the first part of the solder resist is positioned lower than an upper surface of the first trace.

    CIRCUIT BOARD
    6.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20240324102A1

    公开(公告)日：2024-09-26

    申请号：US18577077

    申请日：2022-07-08

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Byeong Kyun CHOI ,  Moo Seong KIM ,  Woo Seop SIM

    IPC: H05K1/11 ,  H01L23/498 ,  H05K1/09 ,  H05K1/18

    CPC classification number: H05K1/115 ,  H01L23/49822 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/09827

    Abstract: A circuit board according to an embodiment includes an insulating layer, a first circuit pattern layer disposed on the insulating layer; a second circuit pattern layer disposed below the insulating layer; and a via passing through the insulating layer and connecting the first circuit pattern layer and the second circuit pattern layer, wherein the via has a first width at an upper surface and a second width less than the first width at a first region between the upper surface and a lower surface, wherein the first region is a region with a minimum width among all regions of the via, and wherein the second width satisfies a range of 70% to 99% of the first width.

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
    7.
    发明申请
    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR 审中-公开

    公开(公告)号：US20200236789A1

    公开(公告)日：2020-07-23

    申请号：US16651143

    申请日：2018-09-18

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Hee Young CHUNG ,  Jae Man PARK ,  Moo Seong KIM

    IPC: H05K3/06 ,  H05K1/11 ,  H05K3/26

    Abstract: A printed circuit board according to one embodiment of the present invention comprises an insulation board and a plurality of metal electrodes disposed on the insulation board, wherein: the plurality of metal electrodes include a first electrode and a second electrode; the first electrode includes a first surface parallel to an upper surface of the insulation board, a second surface facing the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface facing the first side surface; a part of the first side surface and a part of the second side surface protrude toward the outside of the first electrode in the direction parallel to the upper surface of the insulation board; the first side surface protrudes farther in an area adjacent to the first surface than in an area adjacent to the second surface; and the second side surface protrudes farther in the area adjacent to the second surface than in the area adjacent to the first surface.

    HOT PLATE AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    HOT PLATE AND METHOD OF MANUFACTURING THE SAME 有权
    热板及其制造方法

    公开(公告)号：US20140251976A1

    公开(公告)日：2014-09-11

    申请号：US14353199

    申请日：2012-10-19

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Ick Chan KIM ,  Moo Seong KIM

    IPC: H01L21/67 ,  C23C26/00

    CPC classification number: C23C26/00 ,  C23C16/4581 ,  H01L21/67103

    Abstract: Disclosed are a hot plate and a method of manufacturing the same. The method includes the steps of preparing a first barrier layer, laminating a first heat transfer layer on the first barrier layer, and laminating a second barrier layer on the first heat transfer layer. The first barrier layer or the second barrier layer includes a plurality of first sub-nano-barrier layers and a plurality of second sub-nano-barrier layers. The hot plate includes a first barrier layer, a first heat transfer layer on the first barrier layer, and a second barrier layer on the first heat transfer layer. The first barrier layer or the second barrier layer includes a plurality of first sub-nano-barrier layers and a plurality of second sub-nano-barrier layers.

    Abstract translation: 公开了一种热板及其制造方法。 该方法包括以下步骤：制备第一阻挡层，在第一阻挡层上层叠第一传热层，以及在第一传热层上层压第二阻挡层。 第一阻挡层或第二阻挡层包括多个第一亚纳米阻挡层和多个第二亚纳米阻挡层。 热板包括第一阻挡层，第一阻挡层上的第一传热层和第一传热层上的第二阻挡层。 第一阻挡层或第二阻挡层包括多个第一亚纳米阻挡层和多个第二亚纳米阻挡层。

    CIRCUIT BOARD
    9.
    发明申请
    CIRCUIT BOARD 有权

    公开(公告)号：US20250040032A1

    公开(公告)日：2025-01-30

    申请号：US18580365

    申请日：2022-08-10

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Bae SHIN ,  Moo Seong KIM ,  Soo Min LEE ,  Jae Hun JEONG

    IPC: H05K1/02 ,  H01Q1/22 ,  H01Q1/48 ,  H05K1/11

    Abstract: A circuit board according to an embodiment includes a first substrate layer; and a second substrate layer disposed on the first substrate layer and including a cavity, wherein the cavity of the second substrate layer includes a first part disposed adjacent to an upper surface of the second substrate layer and having a first inclination such that a width gradually decreases toward a lower surface of the second substrate layer; and a second part disposed below the first part adjacent to the lower surface of the second substrate layer and having a second inclination such that a width gradually decreases toward the lower surface of the second substrate layer, and the first inclination of the first part relative to a bottom surface of the cavity is greater than the second inclination of the second part relative to the bottom surface of the cavity, and a vertical length of the first part is different from a vertical length of the second part.

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