公开(公告)号：US10811567B2

公开(公告)日：2020-10-20

申请号：US16082237

申请日：2017-03-02

申请人： LG INNOTEK CO., LTD.

发明人： Woo Sik Lim ,  Hyun Joon Kim ,  Jae Seok Park ,  Jong Seok Park ,  Kum Tae Lee

IPC分类号： H01L33/40 ,  H01L27/15 ,  H01L33/56 ,  H01L33/62

摘要： Embodiments is disclosed a light emitting module and a display device. The light emitting module includes, a substrate, a first lead electrode and a second lead electrode disposed on the substrate and electrically separated from each other; and at least one light emitting device disposed on the substrate, wherein the light emitting device includes a first electrode facing the first lead electrode and including a ferromagnetism material and a second electrode facing the second lead electrode and including a diamagnetism material, wherein the second lead electrode includes a diamagnetism material, and wherein the first lead electrode comprises a ferromagnetism material.

公开(公告)号：US10705370B2

公开(公告)日：2020-07-07

申请号：US16078562

申请日：2017-02-23

申请人： LG INNOTEK CO., LTD.

发明人： Seung Han Hyun ,  Hyun Joon Kim ,  Jae Seok Park ,  Kum Tae Lee

IPC分类号： G02F1/1335 ,  H01L33/50 ,  H01L33/52 ,  H05B33/14 ,  H05B37/02 ,  H01L25/075 ,  H05B47/00 ,  H05B47/10 ,  H01L25/16 ,  H01L33/62

摘要： An embodiment relates to a light emitting module, a light emitting module manufacturing method, a light emitting cabinet, and a display device. The display device of an embodiment includes: a support frame; and a plurality of light emitting cabinets including a plurality of light emitting modules disposed on the support frame, wherein the plurality of light emitting modules may include a substrate, a plurality of light emitting units directly mounted on the substrate, and a black matrix disposed on the substrate to surround each of the plurality of light emitting units. The embodiment may implement uniform color and uniform brightness by providing a light emitting module providing full color, and may implement slimness and high brightness by simplifying a configuration of the light emitting module in a chip on board (COB) type. The embodiment may implement low power driving and improve productivity and yield by simplifying the configuration of the light-emitting module.