公开(公告)号：US10396258B2

公开(公告)日：2019-08-27

申请号：US15314118

申请日：2015-05-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Dae Geun Kim ,  Kyoung Un Kim ,  Seul Ki Kim ,  Bong Kul Min ,  Gyu Hyeong Bak

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L33/64

Abstract: An embodiment comprises: a substrate having a chip mounting region; first and second wiring layers disposed on the substrate around the chip mounting region so as to be spaced apart from each other; and a plurality of light emitting chips disposed on the chip mounting region, wherein the first wiring layer comprises a first wiring pattern disposed at one side of a reference line and having a first concave part, and a first extending pattern extending from the first wiring pattern to the other side of the reference line, the second wiring layer comprises a second wiring pattern disposed at the other side of the reference line and having a second concave part, and a second extending pattern extending from the second wiring pattern to one side of the reference line, and the reference line is a straight line passing through the center of the chip mounting region.