公开(公告)号：US10593848B2

公开(公告)日：2020-03-17

申请号：US15755997

申请日：2016-08-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Dong Hyun Yu ,  Bong Kul Min

IPC: H01L33/62 ,  H01L23/495 ,  H01L25/16 ,  H01L33/48

Abstract: A light-emitting element package according to one embodiment includes first and second lead frames electrically separated from each other; a package body including a slope configured to define a cavity along with at least one of the first or second lead frame; and at least one element unit disposed in an element area of at least one of the first or second lead frame, the element unit including a light-emitting element and a protective element, wherein the package body is disposed between the protective element and the light-emitting element.

公开(公告)号：US10541235B2

公开(公告)日：2020-01-21

申请号：US16358876

申请日：2019-03-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Bong Kul Min

IPC: H01L33/00 ,  H01L25/16 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L25/13 ,  H01L29/866 ,  H01L33/38 ,  F21K9/00 ,  H01L33/50 ,  H01L33/56

Abstract: A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.

公开(公告)号：US10424704B2

公开(公告)日：2019-09-24

申请号：US15744698

申请日：2016-07-18

Applicant: LG INNOTEK CO., LTD.

Inventor： Dong Hyun Yu ,  Bong Kul Min

IPC: H01L33/36 ,  H01L33/52 ,  H01L33/64 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60 ,  H01L25/16 ,  H01L33/48

Abstract: A light-emitting device package according to an embodiment includes first and second lead frames, a package body exposing a portion of a front surface of at least one of the first or second lead frame, a light-emitting device, a protecting device, and at least one wire configured to electrically connect the exposed front surface of at least one of the first or second lead frame to at least one of the light-emitting device or the protecting device, wherein the exposed front surface of at least one of the first or second lead frame includes at least one bonding area connected to the at least one wire, wherein the at least one bonding area has a planar shape in which the at least one bonding area is disposed so as to contact a corner of the exposed front surface of at least one of the first or second lead frame.

公开(公告)号：US10385266B2

公开(公告)日：2019-08-20

申请号：US15506336

申请日：2015-08-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Ji Wook Moon ,  Hyoung Jin Kim ,  Chang Man Lim ,  Bong Kul Min

IPC: C01F17/00 ,  C09K11/08 ,  C09K11/61 ,  C09K11/77 ,  H01L33/00 ,  H01L33/50

Abstract: An embodiment provides a phosphor composition and a light emitting device package comprising the same, wherein the phosphor composition comprises green phosphor, amber phosphor, and red phosphor, wherein the amber phosphor is expressed as chemical formula Lim−2XSi12−m−nAlm+nOnN16−n:Eu2+, where 2≤m≤5, 2≤n≤10, 0.01≤X≤1. The light emitting element package of the embodiment can display white light having improved brightness and color rendering index.

公开(公告)号：US10128423B2

公开(公告)日：2018-11-13

申请号：US14953081

申请日：2015-11-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Song Eun Lee ,  Gyu Hyeong Bak ,  Bong Kul Min

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60 ,  H01L33/56 ,  H01L25/16 ,  H01L33/52 ,  H01L33/50

Abstract: Disclosed are a light emitting device and a lighting apparatus having the same. The light emitting device includes a plurality of lead frames, a first body having non-transmissive resin material on top surfaces of the lead frames, a second body having transmittance resin material on a top surface of the first body, a light emitting chip on at least one of the lead frames exposed in the first opening of the second body, and a first transmissive layer disposed in the first opening of the second body. The first body and the second body is disposed around the light emitting chip.

公开(公告)号：US09991241B2

公开(公告)日：2018-06-05

申请号：US15492235

申请日：2017-04-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Bong Kul Min

IPC: H01L33/00 ,  H01L25/16 ,  H01L33/60 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L25/167 ,  F21K9/00 ,  H01L25/0753 ,  H01L25/13 ,  H01L29/866 ,  H01L33/38 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.

公开(公告)号：US09683715B2

公开(公告)日：2017-06-20

申请号：US14589619

申请日：2015-01-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Bong Kul Min

IPC: H01L33/00 ,  F21V5/04 ,  H01L33/58 ,  H01L33/60 ,  G02B19/00 ,  F21V7/00 ,  H01L33/54 ,  H01L25/075 ,  F21Y115/10

CPC classification number: F21V5/04 ,  F21V7/0066 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  G02B19/0095 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed is a light emitting apparatus. The light emitting apparatus includes a package body; first and second electrodes; a light emitting device electrically connected to the first and second electrodes and including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second conductive semiconductor layers; and a lens supported on the package body and at least apart of the lens including a reflective structure. The package body includes a first cavity, one ends of the first and second electrodes are exposed in the first cavity and other ends of the first and second electrodes are exposed at lateral sides of the package body, and a second cavity is formed at a predetermined portion of the first electrode exposed in the first cavity.

公开(公告)号：US20160329311A1

公开(公告)日：2016-11-10

申请号：US15213548

申请日：2016-07-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Bong Kul Min

IPC: H01L25/16 ,  H01L33/64 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/167 ,  F21K9/00 ,  H01L25/0753 ,  H01L25/13 ,  H01L29/866 ,  H01L33/38 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.

Abstract translation: 提供发光器件封装。 发光器件封装可以包括具有包括侧表面和底部的空腔的主体，以及设置在主体的腔的底部中并彼此分离的第一反射杯和第二反射杯。 可以在第一反射杯中设置第一发光器件，并且可以在第二反射杯中设置第二发光器件。

公开(公告)号：US10998476B2

公开(公告)日：2021-05-04

申请号：US16355012

申请日：2019-03-15

Applicant: LG INNOTEK CO., LTD.

Inventor： Dong Hyun Yu ,  Bong Kul Min

IPC: H01L33/36 ,  H01L33/52 ,  H01L33/64 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60 ,  H01L25/16 ,  H01L33/48

Abstract: A light-emitting device package includes a first lead frame; a second lead frame separated from the first lead frame in a first direction; a package body having a cavity exposing a portion of the second lead frame. Further, the cavity includes an inclined inner surface inclining with respect to an upper surface of the second lead frame; a light-emitting diode disposed on the exposed portion of the second lead frame; a hole in the inclined inner surface of the cavity and exposing a portion of the first lead frame; a protection device disposed in the hole and on the exposed portion of the first lead frame; a first wire having a first end connected to the light-emitting diode, and a second end connected to the first lead frame; a second wire having a first end connected to the light-emitting diode, and a second end connected to the second lead frame; and a third wire having a first end connected to the protection device, and a second end connected to the exposed portion of the second lead frame.

公开(公告)号：US10788701B2

公开(公告)日：2020-09-29

申请号：US15490506

申请日：2017-04-18

Applicant: LG INNOTEK CO., LTD.

Inventor： Bong Kul Min

IPC: G02F1/13357 ,  H01L25/16 ,  H01L33/62 ,  H01L33/60

Abstract: A light emitting device package is disclosed. The light emitting device package includes a body, first and second reflection cups spaced apart from each other in a top surface of the body, a first connection pad disposed in the top surface of the body, spaced apart from the first and second reflection cups, a first light emitting diode mounted in the first reflection cup, a second light emitting diode mounted in the second reflection cup, and a partition wall disposed between the first reflection cup and the second reflection cup, the partition wall extended from the top surface of the body upwardly.