Thermoelectric device
    1.
    发明授权

    公开(公告)号:US12102006B2

    公开(公告)日:2024-09-24

    申请号:US17757920

    申请日:2020-12-16

    摘要: A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first buffer layer disposed on the first substrate, a first electrode disposed on the first buffer layer, a P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode, a second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg, a second buffer layer disposed on the second electrode, and a second substrate disposed on the second buffer layer, wherein at least one of the first buffer layer and the second buffer layer includes a silicone resin and an inorganic material, and the Young's modulus of at least one of the first buffer layer and the second buffer layer is 1 to 65 MPa.

    Thermoelectric module
    2.
    发明授权

    公开(公告)号:US11758811B2

    公开(公告)日:2023-09-12

    申请号:US17270163

    申请日:2019-09-10

    发明人: Tae Su Yang

    IPC分类号: H10N10/17 H10N10/80

    CPC分类号: H10N10/17 H10N10/80

    摘要: A thermoelectric module according to one embodiment of the present invention comprises: a first metal substrate; a thermoelectric element; and a second metal substrate, wherein the thermoelectric element comprises a first resin layer, a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a plurality of second electrodes and a second resin layer, wherein the width of the first metal substrate is greater than the width of the second metal substrate, and the first metal substrate comprises a first surface in direct contact with the first resin layer and a second surface opposite to the first surface, and further comprises: a first support spaced apart from the thermoelectric element and a side surface of the second metal substrate on the first surface of the first metal substrate, and arranged so as to surround the thermoelectric element and the side surface of the second metal substrate; and a sealing material spaced apart from the thermoelectric element and the side surface of the second metal substrate, on the first surface of the first metal substrate, and arranged so as to surround the thermoelectric element and the side surface of the second metal substrate.