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公开(公告)号：US12029123B2
公开(公告)日：2024-07-02
申请号：US17237607
申请日：2021-04-22
发明人： Yu-Hao Chen , Hui Yu Lee , Jui-Feng Kuan
CPC分类号： H10N10/17 , H01L23/38 , H01L25/167 , H10N10/01 , H10N10/80
摘要： A semiconductor structure includes an optical component and a thermal control mechanism adjacent to the optical component and configured to control a temperature of the optical component. The thermal control mechanism includes a conductive structure, a first thermoelectric member and a second thermoelectric member opposite to the first thermoelectric member. The first thermoelectric member and the second thermoelectric member are electrically connected to the conductive structure. The first thermoelectric member and the second thermoelectric member have opposite conductive types. The semiconductor structure further includes a first dielectric layer surrounding the optical component and a portion of the thermal control mechanism, wherein the conductive structure is over the first dielectric layer, and the first thermoelectric member and the second thermoelectric member are surrounded by the first dielectric layer. The semiconductor structure further includes a first via extending through the first dielectric layer and electrically connected to the conductive structure.
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公开(公告)号：US11837524B2
公开(公告)日：2023-12-05
申请号：US17352612
申请日：2021-06-21
申请人： Raytheon Company
摘要： A cooling device for integrated circuits. The device includes: a plurality TEC cooling cells arranged in an array, wherein each of the cells includes a controller coupled to at least one TEC device; and a single power connector that provides power to all the cells in the array. The controller of each cell in the array is operable to control the at least one TEC it is coupled to with power received from the single power connector.
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公开(公告)号：US20230371378A1
公开(公告)日：2023-11-16
申请号：US18314448
申请日：2023-05-09
申请人： Danfoss A/S
摘要： A method (100) for producing a temperature sensor (200), the method (100) comprising: providing (101) a cable (103), wherein electrical conductor portions (105) are protruding from an end of the cable (103); connecting (107) at least one temperature sensor element (109) to the electrical conductor portions (105) protruding from the cable (103); providing (111) a sensor capsule (113); connecting (115) a proximal end surface of the sensor capsule (113) to the end of the cable (103), so that the sensor capsule (113) surrounds the at least one temperature sensor element (109); providing (117) at least one drain opening (119) in the sensor capsule (113) near a connection area (121) of the cable (103) and the sensor capsule (113); filling (123) up a volume (125) of the sensor capsule (113) with a thermally conducting ceramic filler (127); connecting (129) an end cap (131) to a distal end surface (133) of the sensor capsule (113); sealing (135) the drain opening (119).
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4.发明公开公开(公告)号：US20230256256A1
公开(公告)日：2023-08-17
申请号：US18106473
申请日：2023-02-06
发明人： Clark D BOYD , Bradbury R FACE , Jeffrey D SHEPARD
IPC分类号： A61N1/378 , H02J7/34 , H01J45/00 , H02J50/00 , H10N10/01 , H10N10/80 , H01L25/04 , H01L25/00
CPC分类号： A61N1/3785 , H02J7/34 , H01J45/00 , H02J50/001 , H10N10/01 , H10N10/80 , H01L25/04 , H01L25/50 , H01L25/0652
摘要： A method is provided for producing an electrically-powered device and/or component that is embeddable in a solid structural component, and a system, a produced device and/or a produced component is provided. The produced electrically powered device includes an attached autonomous electrical power source in a form of a unique, environmentally-friendly structure configured to transform thermal energy at any temperature above absolute zero to an electric potential without any external stimulus including physical movement or deformation energy. The autonomous electrical power source component provides a mechanism for generating renewable energy as primary power for the electrically-powered device and/or component once an integrated structure including the device and/or component is deployed in an environment that restricts future access to the electrical power source for servicing, recharge, replacement, replenishment or the like.
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公开(公告)号：US20230138483A1
公开(公告)日：2023-05-04
申请号：US17918560
申请日：2021-04-13
申请人： Sheetak, Inc.
发明人： Uttam Ghoshal
摘要： The present disclosure is related to thermoelectric energy harvesting and powering of Internet-of-Things (IoT) devices and systems. The thermoelectric energy harvesting device includes a thermoelectric converter electrically coupled to voltage rectifier and a power storage medium. The first side of the thermoelectric converter is exposed to ambient air with fluctuating temperatures, while the second side is anchored to a stable temperature. Power generated across the temperature differential can be captured in the power storage medium. The harvester may also include a device to move the harvester relative to the air and, by generating convection cooling of the first side, increase the net energy harvested.
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6.发明公开公开(公告)号：US20240327019A1
公开(公告)日：2024-10-03
申请号：US18616576
申请日：2024-03-26
发明人： François Pons , Christian Flemin
摘要： An aircraft propulsion assembly with at least one ventilation device to cool at least one zone of the propulsion assembly. The ventilation device is regulated and includes at least one ventilation hole emerging in the zone to be cooled, at least one valve movable between a closed position where the valve shuts the ventilation hole and an open position where the valve at least partially frees the ventilation hole, at least one thermoelectric generator to generate an electric current and at least one automatic control to control the position of the valve by using the electrical current generated by the thermoelectric generator. The bleed air flow rate can be adjusted as a function of the cooling needs. An aircraft including at least one such propulsion assembly is disclosed.
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公开(公告)号：US12055800B2
公开(公告)日：2024-08-06
申请号：US17443668
申请日：2021-07-27
发明人： Yu-Hao Chen , Hui Yu Lee , Jui-Feng Kuan , Chien-Te Wu
IPC分类号： G02F1/01 , H10N10/01 , H10N10/17 , H10N10/80 , H10N10/852 , H10N10/855
CPC分类号： G02F1/0147 , G02F1/011 , H10N10/01 , H10N10/17 , H10N10/80 , G02F2203/50 , H10N10/852 , H10N10/855
摘要： A semiconductor structure includes, an optical component and a thermal control mechanism. The optical component includes a first main path that splits into a first side path and a second side path so that the first side path and the second side path are separated from one another. The thermal control mechanism configured to control a temperature of both the first side path and the second side path, wherein the first thermal control mechanism includes a first thermoelectric member and a second thermoelectric member that are positioned between the first side path and the second side path and the first thermoelectric member and the second thermoelectric member have opposite conductive types.
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公开(公告)号：US20240100554A1
公开(公告)日：2024-03-28
申请号：US18479363
申请日：2023-10-02
IPC分类号： B05B12/12 , F16K31/02 , G01N27/22 , G05B13/02 , G05B19/042 , G05D22/02 , H10N10/17 , H10N10/80
CPC分类号： B05B12/12 , F16K31/025 , G01N27/223 , G05B13/024 , G05B19/042 , G05D22/02 , H10N10/17 , H10N10/80 , A01G25/16
摘要： Disclosed herein are systems and techniques for controlling irrigation systems using thermoelectric devices. A thermoelectric generator can produce a voltage that is proportional to a temperature differential measured locally, adjacent an irrigation target or sprinkler. The voltage can be used to control the irrigation sprinkler, for example, by providing a signal to a control valve that is fluidly coupled with the sprinkler. The system can be self-contained, without external electrical connections and without solar panels, allowing for remote use that is not dependent upon solar irradiance. The system can further be tuned to individually control irrigation components, such as by calibrating the voltage to soil moisture or other conditions, and actuating the valve when the voltage reaches a threshold indicative of the condition.
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9.发明授权公开(公告)号：US11923131B2
公开(公告)日：2024-03-05
申请号：US17096699
申请日：2020-11-12
IPC分类号： H01F7/02 , B22F10/25 , B22F10/38 , B32B1/04 , B32B3/02 , B32B3/26 , B32B3/30 , B32B5/14 , B32B5/16 , B32B7/025 , B32B7/027 , B32B15/04 , B33Y80/00 , C23C4/01 , C23C4/04 , C23C4/06 , C23C4/08 , C23C4/12 , C23C24/00 , C23C24/04 , C23C30/00 , H01F7/00 , H01F41/14 , H01F41/20 , H01F41/30 , H01F41/34 , H10N10/00 , H10N10/80 , H10N10/857 , H10N15/00 , H10N30/00 , H10N30/01 , H10N30/074 , H10N30/076 , H10N60/00 , H10N60/01 , B33Y10/00 , H10N10/01
CPC分类号： H01F41/14 , B22F10/25 , B22F10/38 , B32B1/04 , B32B3/02 , B32B3/26 , B32B3/30 , B32B5/14 , B32B5/142 , B32B5/145 , B32B5/16 , B32B7/025 , B32B7/027 , B32B15/04 , B32B15/043 , B33Y80/00 , C23C4/01 , C23C4/04 , C23C4/06 , C23C4/08 , C23C4/12 , C23C24/00 , C23C24/04 , C23C30/00 , C23C30/005 , H01F7/00 , H01F7/02 , H01F41/20 , H01F41/30 , H01F41/34 , H10N10/00 , H10N10/80 , H10N10/857 , H10N15/00 , H10N30/00 , H10N30/01 , H10N30/074 , H10N30/076 , H10N30/1051 , H10N60/00 , H10N60/01 , B22F2999/00 , B33Y10/00 , C22C2202/00 , H10N10/01 , Y10T428/12389 , Y10T428/12396 , Y10T428/12458 , Y10T428/12493 , Y10T428/12528 , Y10T428/12535 , Y10T428/12681 , Y10T428/24942 , Y10T428/249921 , Y10T428/26 , B22F2999/00 , B22F10/25 , B22F2207/01 , C22C2202/02
摘要： A product includes an array of cold spray-formed structures. Each of the structures is characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of a raw material from which the structure is formed, and essentially the same functional properties as the raw material. A product includes a cold spray-formed structure characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of a raw material from which the structure is formed, and essentially the same functional properties as the raw material.
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公开(公告)号：US20230152011A1
公开(公告)日：2023-05-18
申请号：US17989938
申请日：2022-11-18
发明人： Amir SADRI , Nenad KIRCANSKI , Thanh-Vi TRAN , Carl MARLOWE , Brian David WILSON
CPC分类号： F25B21/04 , B01L7/00 , B01L7/52 , H10N10/10 , H10N10/80 , B01L2300/1805 , B01L2300/08 , B01L2300/123
摘要： A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.
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