公开(公告)号：US20210098964A1

公开(公告)日：2021-04-01

申请号：US17041067

申请日：2019-05-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Myung Sub KIM ,  Woo Jin MOON ,  Ju Young PARK

IPC: H01S5/022 ,  H01S5/183 ,  H01S5/42 ,  H01S5/042

Abstract: In a surface emitting laser package, a surface emitting laser element and a substrate may be electrically connected through a diffusion part. In detail, according to the surface emitting laser package, a housing includes a step, the diffusion part is disposed at the step of the housing, and the surface emitting laser element and the substrate may be electrically connected through a connection wiring extending through the housing to correspond to the step and a conductive line disposed at one side of the diffusion part.