Thin film transistor having copper alloy wire and method of manufacturing the same
    1.
    发明申请
    Thin film transistor having copper alloy wire and method of manufacturing the same 有权
    具有铜合金线的薄膜晶体管及其制造方法

    公开(公告)号:US20040142516A1

    公开(公告)日:2004-07-22

    申请号:US10756378

    申请日:2004-01-14

    CPC classification number: H01L29/66765 H01L29/4908 Y10S438/927

    Abstract: A thin film transistor and a method of manufacturing the same includes forming a copper alloy line on substrate, an oxidation film formed on the upper surface of the copper alloy line. The copper alloy line includes a concentration y of magnesium, and the copper alloy line has a thickness t. the concentration y of magnesium in copper alloy line is related to the thickness is as follows: 1 y null 94 t

    Abstract translation: 薄膜晶体管及其制造方法包括在基板上形成铜合金线,形成在铜合金线的上表面上的氧化膜。 铜合金线包含镁的浓度y,铜合金线的厚度为t。 铜合金线中镁的浓度y与厚度有关如下: 1 y 94

    Patent Agency Ranking