Abstract:
A method of crystallizing silicon including preparing a substrate having an amorphous silicon film formed thereon, aligning a mask having a first energy region and a second energy region over a first region of the amorphous silicon film formed on the substrate, irradiating a laser beam through the first and second energy regions of the mask onto the first region of the amorphous silicon film, crystallizing the first region of the amorphous silicon film by irradiating the laser beam through the first energy region of the mask, and activating the crystallized first region by irradiating the laser beam through the second energy region.
Abstract:
A method of forming a thin film transistor includes forming a gate electrode on a substrate, forming a gate insulating layer on the gate electrode, forming an amorphous silicon layer on the gate insulating layer, crystallizing the amorphous silicon layer within an active region corresponding to the gate electrode to form a polycrystalline silicon layer, etching the amorphous silicon layer such that an etch rate of amorphous silicon is greater than an etch rate of polycrystalline silicon to form a semiconductor layer of polycrystalline silicon in the active region, and forming source and drain electrodes on the semiconductor layer.