公开(公告)号：US20160218501A1

公开(公告)日：2016-07-28

申请号：US15088714

申请日：2016-04-01

Applicant: LINEAR TECHNOLOGY CORPORATION

Inventor： Daniel James EDDLEMAN ,  Mitchell Edward LEE ,  Zhizhong HOU

IPC: H02H5/04 ,  H03K17/082

CPC classification number: H02H5/04 ,  H01C1/16 ,  H03K17/08104 ,  H03K17/0822 ,  H03K2017/0806

Abstract: A circuit for protecting a semiconductor element is provided in a system for supplying power from an input node to an output node. The circuit has an analog multiplier responsive to a voltage across the semiconductor element and a current flowing through the semiconductor element to produce an output voltage. A transconductance amplifier is coupled to an output of the analog multiplier for receiving the output voltage of the analog multiplier to produce an output current. An analog RC circuit coupled to the output of the transconductance amplifier is configurable to include a selected number of resistive elements having selected resistance values and a selected number of capacitive elements having selected capacitance values. The configuration of the RC circuit is carried out to provide an RC thermal model that reproduces a desired thermal behavior of the semiconductor element. The RC circuit is responsive to the output current of the transconductance amplifier to produce an output voltage used to control the semiconductor element.

Abstract translation: 用于保护半导体元件的电路设置在用于从输入节点向输出节点供电的系统中。 电路具有对半导体元件两端的电压和流过半导体元件的电流产生输出电压的模拟乘法器。 跨导放大器耦合到模拟乘法器的输出端，用于接收模拟乘法器的输出电压以产生输出电流。 耦合到跨导放大器的输出的模拟RC电路可配置为包括具有选定电阻值的所选数量的电阻元件和具有所选电容值的所选数量的电容元件。 执行RC电路的配置以提供再现半导体元件的期望热行为的RC热模型。 RC电路响应于跨导放大器的输出电流以产生用于控制半导体元件的输出电压。