公开(公告)号：US20230380288A1

公开(公告)日：2023-11-23

申请号：US18034442

申请日：2021-10-28

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Kunihisa KATO ,  Wataru MORITA ,  Katsuhiko HORIGOME ,  Mutsumi MASUMOTO

IPC: H10N10/17

CPC classification number: H10N10/17

Abstract: Provided is a thin thermoelectric conversion module provided with no support base material and including: an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other; a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, in which the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material, and both surfaces of the thermoelectric conversion module are provided with no base material.

公开(公告)号：US20240023441A1

公开(公告)日：2024-01-18

申请号：US18034430

申请日：2021-10-28

Applicant: LINTEC CORPORATION

Inventor： Yuta SEKI ,  Kunihisa KATO ,  Wataru MORITA ,  Mutsumi MASUMOTO

IPC: H10N10/01 ,  H10N10/17 ,  H10N10/857

CPC classification number: H10N10/01 ,  H10N10/17 ,  H10N10/857

Abstract: Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the integrated body after step (C).