公开(公告)号：US12288768B2

公开(公告)日：2025-04-29

申请号：US17636309

申请日：2020-08-20

Applicant: LINTEC CORPORATION

Inventor： Isao Ichikawa ,  Hidekazu Nakayama ,  Yosuke Sato

IPC: H01L23/00 ,  B22F7/08 ,  B32B7/06 ,  B32B7/12 ,  B32B15/04

Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying, to a substrate, the film-form firing material on the support sheet; peeling off the support sheet from the substrate and the film-form firing material; applying a back surface side of the semiconductor chip to the film-form firing material on the substrate to face each other; and sinter-bonding the semiconductor chip and the substrate by heating the film-form firing material to 200° C. or higher.

公开(公告)号：US09312162B2

公开(公告)日：2016-04-12

申请号：US13665972

申请日：2012-11-01

Applicant: LINTEC Corporation

Inventor： Yosuke Sato ,  Michio Kanai ,  Hayato Nakanishi

IPC: H01L21/683 ,  H01L21/78 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68381 ,  H05K1/02 ,  H05K1/115 ,  Y10T428/24942

Abstract: A dicing sheet includes a base, an intermediate layer on one face of the base, and an pressure sensitive adhesive layer provided on the intermediate layer and having the thickness of 8 to 30 μm. The pressure sensitive adhesive layer includes a compound having an energy ray curable double bond in a molecule, and a storage elasticity G′ at 23° C. of the pressure sensitive adhesive layer before curing is larger than 4 times of a storage elasticity at 23° C. of the intermediate layer. When the dicing sheet is laminated via the adhesive sheet on a wafer formed with a cylinder shape electrodes having a height of 15 μm and a diameter of 15 μm at a pitch of 40 μm having 3 rows 3 columns in equal spacing, at a center of the electrode of the cylinder shape electrodes formed in 3 rows 3 columns, the pressure sensitive adhesive layer does not contact at a part of a height of 7.5 μm or less of the electrode.

Abstract translation: 切割片包括基部，基部的一个面上的中间层和设置在中间层上并具有8〜30μm厚度的压敏粘合剂层。 压敏粘合剂层包括分子中具有能量射线固化性双键的化合物，固化前的压敏粘合剂层的23℃下的储存弹性G'大于23℃时的储存弹性的4倍 C.中间层C. 当切割片通过粘合片层叠在形成有具有15μm的圆柱形电极的晶片和具有相等间隔的3行3列的40μm的间距的15μm的直径的晶片时，在 圆柱形电极的电极形成为3列3列，该压敏粘合剂层在电极的7.5μm或更小的高度的一部分处不接触。