公开(公告)号：US20200040227A1

公开(公告)日：2020-02-06

申请号：US16338524

申请日：2017-09-29

Applicant: LINTEC Corporation

Inventor： Kazuto AIZAWA ,  Jun MAEDA

IPC: C09J9/00 ,  H01L21/683 ,  H01L21/78 ,  C09J7/38

Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.

公开(公告)号：US20210043492A1

公开(公告)日：2021-02-11

申请号：US17083462

申请日：2020-10-29

Applicant: LINTEC Corporation

Inventor： Kazuto AIZAWA ,  Jun MAEDA

IPC: H01L21/683 ,  C09J201/00 ,  H01L21/304 ,  H01L21/78

Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.

公开(公告)号：US20190382633A1

公开(公告)日：2019-12-19

申请号：US16338505

申请日：2017-09-26

Applicant: LINTEC Corporation

Inventor： Kazuto AIZAWA ,  Jun MAEDA ,  Katsuhiko HORIGOME

IPC: C09J133/00 ,  C09J201/00 ,  C09J7/24 ,  C09J7/29 ,  H01L21/304 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E60) of 20-1000 MPa at 60° C.