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公开(公告)号：US11307085B2
公开(公告)日：2022-04-19
申请号：US17097158
申请日：2020-11-13
IPC分类号： G01J1/08 , F21V5/00 , G01J1/04 , G01J1/42 , G03B21/14 , G03B21/26 , H05B35/00 , F21V17/10 , F21Y105/16 , G03B21/20 , F21Y113/10 , F21K9/90
摘要： A light detecting device, a lighting module, and a manufacturing method for the same are provided. The lighting module includes a carrier, a light assembly having a first lighting unit and a second lighting unit, a lens assembly having a first lens and a second lens, and a casing surrounding the lens assembly. The first lighting unit emits a first beam having a first wavelength through the first lens to define a first view angle and the second lighting unit emits a second beam having a second wavelength through the second lens to define a second view angle. The first wavelength is smaller than the second wavelength, and the first view angle is greater than the second view angle.
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公开(公告)号：US11145777B2
公开(公告)日：2021-10-12
申请号：US16738796
申请日：2020-01-09
发明人： Chen-Hsiu Lin , Shih-Chung Huang , Bo-Jhih Chen
IPC分类号： H01L31/0232 , H01L31/101 , H01L31/02 , H05K5/00
摘要： An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.
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