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公开(公告)号：US11145777B2
公开(公告)日：2021-10-12
申请号：US16738796
申请日：2020-01-09
发明人： Chen-Hsiu Lin , Shih-Chung Huang , Bo-Jhih Chen
IPC分类号： H01L31/0232 , H01L31/101 , H01L31/02 , H05K5/00
摘要： An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.
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公开(公告)号：US10727383B2
公开(公告)日：2020-07-28
申请号：US15819599
申请日：2017-11-21
发明人： Yu-Yu Chang , Shih-Chiang Yen , Yi-Hsuan Chen , Chen-Hsiu Lin
IPC分类号： H01L33/58 , H01L33/48 , H01L33/50 , H01L33/62 , H01L25/075 , H01L33/60 , H01L25/16 , H01L29/866
摘要： An LED package structure includes a substrate, an electrode layer and an insulating layer in a coplanar arrangement and disposed on the substrate, an LED chip mounted on the electrode layer and the insulating layer, a phosphor sheet covering entirely a top surface of the LED chip, a first translucent layer disposed on a light emitting surface of the phosphor sheet, and a reflective housing covering the side surfaces of the LED chip and the side surfaces of the phosphor sheet. The light emitting surface has a central region and a ring-shaped region surrounding the central region. The first translucent layer covers at least 60% of an area of the ring-shaped region. A refractive index of the first translucent layer is larger than one and is smaller than that of the phosphor sheet. A top surface of the reflective housing is substantially flush with the light emitting surface.
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公开(公告)号：US20180190884A1
公开(公告)日：2018-07-05
申请号：US15819599
申请日：2017-11-21
发明人： Yu-Yu Chang , Shih-Chiang Yen , Yi-Hsuan Chen , Chen-Hsiu Lin
摘要： An LED package structure includes a substrate, an electrode layer and an insulating layer in a coplanar arrangement and disposed on the substrate, an LED chip mounted on the electrode layer and the insulating layer, a phosphor sheet covering entirely a top surface of the LED chip, a first translucent layer disposed on a light emitting surface of the phosphor sheet, and a reflective housing covering the side surfaces of the LED chip and the side surfaces of the phosphor sheet. The light emitting surface has a central region and a ring-shaped region surrounding the central region. The first translucent layer covers at least 60% of an area of the ring-shaped region. A refractive index of the first translucent layer is larger than one and is smaller than that of the phosphor sheet. A top surface of the reflective housing is substantially flush with the light emitting surface.
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公开(公告)号：US09515241B2
公开(公告)日：2016-12-06
申请号：US14309989
申请日：2014-06-20
发明人： Chen-Hsiu Lin
CPC分类号： H01L33/62 , F21V19/001 , H01L24/97 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
摘要： A metallic frame of an LED structure includes two conductive frames spaced apart from each other with a gap and a plurality of extending arms respectively and integrally extended from the conductive frames. Each conductive frame includes a top surface, a bottom surface, and a lateral surface connecting the top and bottom surfaces. Each top surface comprises a sealed region and a mounting region surrounded by the sealed region, and the sealed and mounting regions of each conductive frame are defined by an insulating body. Each conductive frame has at least one slot concavely formed on the sealed region, and the lateral surface is formed with two openings and the slot is communicated with the two openings, such that the slot of each of the conductive frames is configured to separate at least one of the extending arms from the mounting region of the conductive frames.
摘要翻译： LED结构的金属框架包括彼此隔开间隔的两个导电框架和分别从导电框架整体延伸的多个延伸臂。 每个导电框架包括顶表面，底表面和连接顶表面和底表面的侧表面。 每个顶表面包括密封区域和由密封区域围绕的安装区域，并且每个导电框架的密封和安装区域由绝缘体限定。 每个导电框架具有凹入地形成在密封区域上的至少一个狭槽，并且侧表面形成有两个开口，并且该狭槽与两个开口连通，使得每个导电框架的狭槽被配置为至少分开 从导电框架的安装区域的延伸臂中的一个。
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公开(公告)号：US11774691B2
公开(公告)日：2023-10-03
申请号：US17323051
申请日：2021-05-18
发明人： Cheng-Han Wang , Szu-Tsung Kao , Chih-Li Yu , Cheng-Hong Su , Chun-Wei Huang , Chen-Hsiu Lin
CPC分类号： G02B6/4262 , G02B6/0018 , G02B6/0075 , G02B6/0083 , G02B6/0088 , G02B6/0091 , G02B6/4214 , G02B6/4298
摘要： A light-emitting device and a light emitting module are provided. The light emitting module includes a housing, at least one light guide element, and at least one light emitting element. The housing includes at least one passage passing through its a first surface and a second surface, and a coupling portion formed on an inner surface adjacent to the second surface. The light guide element arranged in the at least one passage has a light emergent surface exposed at one end of the at least one passage and a light incident surface exposed at the other end of the at least one passage. The light emitting element is coupled to the housing by the coupling portion. The light emitting element includes a light emitting surface facing to the light incident surface of the light guide element and a soldering portion exposed from the housing.
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公开(公告)号：US11670739B2
公开(公告)日：2023-06-06
申请号：US17146460
申请日：2021-01-11
发明人： Hao-Wei Hong , Chen-Hsiu Lin , Tsung-Kang Ying
CPC分类号： H01L33/486 , H01L33/502 , H01L33/54 , H01L33/62
摘要： A light emitting diode (LED) package structure including a first light emitting portion, a second light emitting portion, a partition, and a surrounding wall is provided. The first light emitting portion includes a first LED chip emitting a first initial light, and the first initial light passes through the first light emitting portion to form a first white light. The second light emitting portion includes a second LED chip, a third LED chip, and a fourth LED chip. The partition is disposed between the first light emitting portion and the second light emitting portion. The surrounding wall is disposed around the partition, the first light emitting portion, and the second light emitting portion. The first white light has a view angle offset less than 1 degree.
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公开(公告)号：US10658556B2
公开(公告)日：2020-05-19
申请号：US16192111
申请日：2018-11-15
发明人： Chen-Hsiu Lin , Tsung-Kang Ying , Pin-Feng Hung
摘要： An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.
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公开(公告)号：US11959606B2
公开(公告)日：2024-04-16
申请号：US17216827
申请日：2021-03-30
发明人： Chen-Hsiu Lin , Cheng-Ying Lee , Ming-Sung Tsai
IPC分类号： H01L27/15 , F21S41/19 , F21V23/00 , H01L25/16 , H01L29/267 , H01L31/12 , H01L33/00 , H01L33/62 , F21W107/00
CPC分类号： F21S41/192 , F21V23/005 , H01L25/167 , H01L33/62 , F21W2107/00
摘要： A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.
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公开(公告)号：US09705052B1
公开(公告)日：2017-07-11
申请号：US15338289
申请日：2016-10-28
发明人： Yu-Chou Lin , Chen-Hsiu Lin , Chih-Yuan Chen
IPC分类号： H01L21/02 , H01L33/50 , H01L33/56 , H01L33/62 , H01L33/60 , H01L29/866 , H01L25/16 , H01L33/58 , H01L33/64 , H01L49/02 , H01L25/075 , H01L27/02 , G02B5/02
CPC分类号： H01L33/505 , G02B5/0278 , H01L25/0753 , H01L25/167 , H01L27/0248 , H01L28/20 , H01L29/866 , H01L33/46 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48471 , H01L2224/48479 , H01L2924/00014 , H01L2224/4554
摘要： An LED package structure includes a substrate, a circuit layer and an insulating layer both disposed on the substrate, a light-emitting unit, and a reflective housing integrally formed with the insulating layer. The light-emitting unit includes an LED chip and a fluorescent body encapsulating the LED chip. The light-emitting unit is mounted on the insulating layer and the circuit layer. The fluorescent body of the light emitting unit is spaced apart from the circuit layer with a gap in a range of 3˜10 μm. The reflective housing is formed on the insulating layer and the circuit layer and is further filled within the gap. A top plane of the reflective housing arranged away from the substrate is lower than or equal to that of the light-emitting unit, and a distance between the two top planes is in a range of 0˜30 μm.
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公开(公告)号：US09691936B2
公开(公告)日：2017-06-27
申请号：US15083637
申请日：2016-03-29
发明人： Chen-Hsiu Lin
IPC分类号： H01L33/48 , H01L33/00 , H01L33/62 , H01L33/60 , H01L25/075
CPC分类号： H01L33/005 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
摘要： An LED carrier includes a substrate, a metallic layer, an insulating layer, and a reflecting layer. The metallic layer is disposed on the substrate and has a die bonding region and a ring-shaped wiring region separated from the die bonding region. A region arranged between the die bonding region and the ring-shaped wiring region is defined as an insulating region. The insulating layer at least partially covers the insulating region. The reflecting layer is arranged above the die bonding region and at least partially covers the top surface of the insulating layer. Moreover, the instant disclosure also provides a manufacturing method of an LED carrier.
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