公开(公告)号：US20240087778A1

公开(公告)日：2024-03-14

申请号：US17940989

申请日：2022-09-08

申请人： FUZETEC TECHNOLOGY CO., LTD.

发明人： Jack Jih-Sang CHEN ,  Chang-Hung Jiang

IPC分类号： H01C7/12 ,  H01C7/108 ,  H05K1/02 ,  H05K1/11

CPC分类号： H01C7/12 ,  H01C7/108 ,  H05K1/0257 ,  H05K1/115 ,  H05K2201/0738

摘要： An over-voltage circuit protection device includes a voltage-dependent resistor component, and a printed circuit board (PCB) component connected to the voltage-dependent resistor component through first and second conductive lead layers. The PCB component includes a PCB body, a first conductive portion, a second conductive portion, at least one first conductive via and at least one second conductive via. The first and second conductive portions are disposed on the PCB body, and are electrically insulated from each other. The first and second conductive vias extend through the PCB body, and are defined by via-defining walls respectively covered by the first and second conductive portions.

公开(公告)号：US09997818B2

公开(公告)日：2018-06-12

申请号：US14654797

申请日：2014-01-13

申请人： Alcatel-Lucent

发明人： Bartlomiej Kozicki ,  Eric Van Den Berg

IPC分类号： H01P3/08 ,  H01P3/02 ,  H05K1/02 ,  H05K1/16

CPC分类号： H01P3/026 ,  H01P3/08 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0256 ,  H05K1/162 ,  H05K2201/0738

摘要： Transmission device including at least one electric conductor for the transmission of an AC signal and a dielectric material at least partly surrounding the at least one conductor. The dielectric material includes dipoles. The device further includes a dipole orienting system adapted to orient the dipoles and to force the dipoles in a saturation regime in order to limit the movement of the dipoles when the at least one electric conductor conducts an AC signal.

公开(公告)号：US09000453B2

公开(公告)日：2015-04-07

申请号：US13724713

申请日：2012-12-21

申请人： David Hamby ,  Adam Scotch

发明人： David Hamby ,  Adam Scotch

IPC分类号： H01L21/00 ,  H02H3/20 ,  H05K1/02 ,  H05K1/18 ,  H02H7/20 ,  H05K1/16 ,  H02H9/04

CPC分类号： H02H3/20 ,  H02H7/20 ,  H02H9/046 ,  H05K1/0259 ,  H05K1/16 ,  H05K1/189 ,  H05K2201/0329 ,  H05K2201/0738 ,  H05K2201/10106 ,  H05K2201/10174

摘要： Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

摘要翻译： 描述了用于保护诸如发光二极管的电气部件的系统和方法。 在一些实施例中，通过提供固有水平的ESD保护的电路板来保护电气部件免受高电平静电放电（“ESD”）事件的影响。 同时，通过与电耦合到其上的一个或多个二极管来保护这种电气部件免受低电平ESD事件的影响。 一个或多个二极管可以是包括至少一层p型半导体材料和至少一层n型半导体材料的薄膜二极管。 还描述了包括ESD保护的装置和用于制造这种装置的方法。

公开(公告)号：US08968606B2

公开(公告)日：2015-03-03

申请号：US12731557

申请日：2010-03-25

申请人： Lex Kosowsky ,  Bhret Graydon ,  Robert Fleming

发明人： Lex Kosowsky ,  Bhret Graydon ,  Robert Fleming

IPC分类号： H01B1/22 ,  H01L23/62 ,  H01C7/12 ,  H05K1/02 ,  H01C1/142 ,  H01C1/148 ,  H01C7/10 ,  H05K1/03 ,  H05K1/16

CPC分类号： H05K1/0257 ,  H01C1/142 ,  H01C1/148 ,  H01C7/1006 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0738

摘要： Various aspects provide for structures and devices to protect against spurious electrical events (e.g., electrostatic discharge). Some embodiments incorporate a voltage switchable dielectric material (VSDM) bridging a gap between two conductive pads. Normally insulating, the VSDM may conduct current from one pad to the other during a spurious electrical event (e.g., shunting current to ground). Some aspects include gaps having a gap width that is greater than 50% of a spacing between electrical leads connected to the pads. Some devices include single layers of VSDM. Some devices include multiple layers of VSDM. Various devices may be designed to increase a ratio of active volume (of VSDM) to inactive volume.

摘要翻译： 各种方面提供了用于防止假电气事件（例如静电放电）的结构和装置。 一些实施例包括桥接两个导电焊盘之间的间隙的可开关电介质材料（VSDM）。 通常绝缘，VSDM可能在杂散电气事件（例如，将电流分流到地）期间将电流从一个焊盘传导到另一个焊盘。 一些方面包括间隙宽度大于连接到焊盘的电引线间距的50％的间隙。 一些设备包括VSDM的单层。 一些设备包括多层VSDM。 可以设计各种设备以增加活动体积（VSDM）与非活动体积的比率。

公开(公告)号：US08463586B2

公开(公告)日：2013-06-11

申请号：US12820936

申请日：2010-06-22

申请人： Mokhles M. Mezghani ,  Larry S. Fung

发明人： Mokhles M. Mezghani ,  Larry S. Fung

IPC分类号： G06G7/48

CPC分类号： G06K19/07345 ,  G01V99/00 ,  G01V2210/663 ,  G06K19/07318 ,  G06T17/05 ,  G06T17/20 ,  H05K1/0254 ,  H05K1/0373 ,  H05K2201/0738

摘要： Example embodiments utilize machines to model reservoir geometry having geological layers as 2.5D unstructured grids. Example embodiments include program products to simulate a reservoir by generating a reservoir data system, performing a numerical fluid flow simulation, and visualizing the simulation. Data system embodiments include data structures to model a reservoir geometry as laterally unstructured two-dimensional (2D) grids and associated layer depths defining z-lines to thereby define a 2.5D unstructured grid, including datasets for: vertices of the grid cells for the future grid top and bottom surfaces, a number and listing of vertices for each grid cell, cell center coordinates, and vertex adjacency information using a compressed sparse row format. Computer-implemented methods include projecting external and internal boundaries onto a future grid surface; generating 2D unstructured, e.g., Voronoi, grids, for the top and bottom surfaces; and generating z-lines of depths corresponding to reservoir layers to thereby generate 2.5D unstructured grids.

摘要翻译： 示例性实施例利用机器将具有地质层的储层几何形状建模为2.5D非结构化网格。 示例性实施例包括通过产生储层数据系统来模拟储层的程序产品，执行数值流体流动模拟和可视化模拟。 数据系统实施例包括将储层几何模型化为横向非结构化二维（2D）网格和定义z线的相关层深度的数据结构，从而定义2.5D非结构化网格，包括用于将来的网格单元的顶点的数据集 网格顶部和底部表面，使用压缩稀疏行格式的每个网格单元的顶点的数量和列表，单元格中心坐标和顶点邻接信息。 计算机实现的方法包括将外部和内部边界投射到未来的网格表面; 产生用于顶表面和底表面的2D非结构化的，例如Voronoi，网格; 并生成对应于储层的深度的z行，从而产生2.5D非结构化网格。

公开(公告)号：US20120211773A1

公开(公告)日：2012-08-23

申请号：US13359410

申请日：2012-01-26

申请人： Robert Fleming ,  Daniel Vasquez ,  Michael Glickman

发明人： Robert Fleming ,  Daniel Vasquez ,  Michael Glickman

IPC分类号： H01L33/08

CPC分类号： H05K1/0254 ,  H01L23/60 ,  H01L25/167 ,  H01L27/3202 ,  H01L27/3204 ,  H01L33/62 ,  H01L51/5203 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/10106 ,  H01L2924/00

摘要： A circuit comprising an array of light emitting diodes (LEDs), and a layer of VSD material positioned to contact an input and an output of each LED in the array of LEDs, so as to protect each LED from both a forward surge and a reverse surge of voltage on the array of LEDs. The layer of VSD material is able to switch into a carrying current state in response to either of the forward or reverse surge exceeding a characteristic voltage level (VCL) of the VSD material.

摘要翻译： 包括发光二极管阵列（LED）的电路以及定位成接触LED阵列中每个LED的输入和输出的VSD材料层，以便保护每个LED免于正向浪涌和反向 LED阵列上的电压波动。 响应于正向或反向浪涌中的任一个超过VSD材料的特征电压电平（VCL），VSD材料层能够切换到承载电流状态。

公开(公告)号：US08222537B2

公开(公告)日：2012-07-17

申请号：US12483223

申请日：2009-06-11

申请人： George Dudnikov, Jr. ,  Franz Gisin

发明人： George Dudnikov, Jr. ,  Franz Gisin

IPC分类号： H05K1/11

CPC分类号： H05K3/429 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/116 ,  H05K1/167 ,  H05K3/184 ,  H05K3/422 ,  H05K2201/0187 ,  H05K2201/0738 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/09718 ,  H05K2201/09881 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via structures are made by selectively depositing plating resist in one or more locations in a sub-composite structure. A plurality of sub-composite structures with plating resist deposited in varying locations are laminated to form a PCB stackup of a desired PCB design. Through-holes are drilled through the PCB stackup through conductive layers, dielectric layers and through the plating resist. Thus, the PCB panel has multiple through-holes that can then be plated simultaneously by placing the PCB panel into a seed bath, followed by immersion in an electroless copper bath. Such partitioned vias increase wiring density and limit stub formation in via structures. Such partitioned vias allow a plurality of electrical signals to traverse each electrically isolated portion without interference from each other.

摘要翻译： 公开了通过在PCB堆叠中使用电镀抗蚀剂将多个通孔结构同时分隔成电隔离部分的系统和方法。 通过在子复合结构中的一个或多个位置选择性地沉积电镀抗蚀剂来制造这种通孔结构。 具有在不同位置沉积的电镀抗蚀剂的多个亚复合结构层压以形成期望的PCB设计的PCB堆叠。 通过PCB堆叠穿过导电层，电介质层和通过电镀抗蚀剂钻穿孔。 因此，PCB面板具有多个通孔，然后可以通过将PCB面板放置在种子池中，然后浸入无电解铜浴中而同时进行电镀。 这种分隔的通孔增加布线密度并限制通孔结构中的短截线形成。 这种分隔的通孔允许多个电信号穿过每个电隔离部分而没有彼此的干扰。

公开(公告)号：US20120103932A1

公开(公告)日：2012-05-03

申请号：US13347585

申请日：2012-01-10

申请人： Lex Kosowsky

发明人： Lex Kosowsky

IPC分类号： B05D3/10 ,  B05D5/12 ,  C25D5/02

CPC分类号： H05K1/0254 ,  C25D5/54 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

摘要： A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.

摘要翻译： 一种方法包括提供具有特征电压的电压可切换电介质材料，将电压可切换电介质材料暴露于与导电材料相关的离子源，并且产生电源和可切换电介质材料之间的电压差大于 特征电压。 允许电流从电压可切换介电材料流出，并且导电材料沉积在可开关电介质材料上。 身体包括电​​压可​​切换电介质材料和使用电化学过程沉积在可开关电介质材料上的导电材料。 在一些情况下，使用电镀沉积导电材料。

公开(公告)号：US08117743B2

公开(公告)日：2012-02-21

申请号：US12953158

申请日：2010-11-23

申请人： Lex Kosowsky

发明人： Lex Kosowsky

IPC分类号： H05K3/10

CPC分类号： H05K1/0254 ,  C25D5/54 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

摘要： A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.

摘要翻译： 一种方法包括提供具有特征电压的电压可切换电介质材料，将电压可切换电介质材料暴露于与导电材料相关的离子源，并且产生电源和可切换电介质材料之间的电压差大于 特征电压。 允许电流从电压可切换介电材料流出，并且导电材料沉积在可开关电介质材料上。 身体包括电​​压可​​切换电介质材料和使用电化学过程沉积在可开关电介质材料上的导电材料。 在一些情况下，使用电镀沉积导电材料。

公开(公告)号：US20110302777A1

公开(公告)日：2011-12-15

申请号：US13212858

申请日：2011-08-18

申请人： Karen Shrier

发明人： Karen Shrier

IPC分类号： H05K3/10

CPC分类号： H01R13/6485 ,  H01C7/005 ,  H01C17/06586 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/0052 ,  H05K2201/0738 ,  Y10T29/49107 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49195 ,  Y10T29/49222

摘要： Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A layered structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.

摘要翻译： 在使用印刷电路板制造技术的干扰事件发生期间能够保护电子部件的装置。 形成层状结构，其包含夹在两个电极层之间的基于聚合物的制剂。 这些装置可以以面板形式制造，提供大量的装置，其可以从面板上移除并直接施加到待保护的部件上。 期望的图案可以通过光蚀刻技术形成在任一个电极层上，从而提供可以针对大量应用而定制的工艺。