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1.发明公开公开(公告)号：US20230211410A1
公开(公告)日：2023-07-06
申请号：US17914571
申请日：2020-12-29
申请人： LS-NIKKO COPPER INC.
发明人： Woo Min JIN , Chang Gun LEE
CPC分类号： B22F1/102 , B22F9/24 , B22F2301/255 , B22F2303/01 , H01B1/22
摘要： The present disclosure relates to a silver powder preparation method comprising: a silver powder preparation step of preparing a silver salt, which comprises silver ions, and then reducing the silver ion so as to precipitate silver particles; a silver powder recovery step of separating silver particles from an aqueous solution or a slurry, which comprises the precipitated silver particles, and then washing and drying same to recover silver powder; and a silver powder coating step of injecting a pH adjuster into the recovered silver powder to adjust the pH, and then injecting a coating agent to coat after the pH adjustment. The pH adjuster is used in the silver powder coating step to adjust the pH, and thus, when silver power is used in a conductive paste, as the rate of change in viscosity over time is low, a conductive paste having excellent viscosity stability can be provided.
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公开(公告)号：US20220023947A1
公开(公告)日：2022-01-27
申请号：US17298437
申请日：2019-11-29
申请人： LS-NIKKO COPPER INC.
发明人： Jae Won CHOI , Chang Gun LEE , Mi Young LEE , Woo Min JIN , Tae Hoon KANG , Young Hwan KIM
摘要： Disclosed is a silver powder preparation method including a silver salt reduction step. The silver salt reduction step includes a reaction solution preparation step for preparing a first reaction solution and a second reaction solution and a precipitation step for allowing reaction between the first reaction solution and the second reaction solution to precipitate silver particles. The first reaction solution contains silver ions, ammonia, an alkali metal salt of an organic acid, and a phosphorous compound, and the second reaction solution contains a reducing agent. The content of the phosphorous compound and the reaction temperature of the precipitation step are adjusted so that the shrinkage rate of the silver powder is adjusted within a range of 5% to 20% at 500° C. when the reaction temperature is heated to 800° C. at a heating rate of 50° C./min.
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