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公开(公告)号:US09930750B2
公开(公告)日:2018-03-27
申请号:US14830032
申请日:2015-08-19
申请人: LUMENS CO., LTD.
发明人: Seung Hyun Oh , Seung Hoon Lee , Sung Yole Yun , Jung A Lim , Sung Sik Jo , In Soo Kim , Tae Kyung Yoo
摘要: A method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
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公开(公告)号:US10667345B2
公开(公告)日:2020-05-26
申请号:US15896706
申请日:2018-02-14
申请人: LUMENS CO., LTD.
发明人: Seung Hyun Oh , Seung Hoon Lee , Sung Yole Yun , Jung A Lim , Sung Sik Jo , In Soo Kim , Tae Kyung Yoo
摘要: Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
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