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公开(公告)号：US20210068304A1
公开(公告)日：2021-03-04
申请号：US17001815
申请日：2020-08-25
Applicant: Laird Technologies, Inc.
Inventor： Jason L. STRADER , Kyle Burke HUFFSTUTLER , Eric Edward TRANTINA
Abstract: Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined the plurality of sides of the memory foam core.
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