公开(公告)号：US20210068304A1

公开(公告)日：2021-03-04

申请号：US17001815

申请日：2020-08-25

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Kyle Burke HUFFSTUTLER ,  Eric Edward TRANTINA

IPC: H05K7/20 ,  F28F13/00 ,  F28F21/02

Abstract: Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined the plurality of sides of the memory foam core.

公开(公告)号：US20200051891A1

公开(公告)日：2020-02-13

申请号：US16659058

申请日：2019-10-21

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Eugene Anthony PRUSS

IPC: H01L23/373 ,  F28F21/02 ,  F28F21/06 ,  H01L23/552

Abstract: A device for absorbing energy from an electronic component includes a low melting alloy layer including a first side and a second side opposing the first side, and coating layers substantially covering the first side and the second side of the low melting alloy layer. In some embodiments, the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture. Other example devices are also disclosed.

公开(公告)号：US20230223315A1

公开(公告)日：2023-07-13

申请号：US18123553

申请日：2023-03-20

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Richard F. HILL

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/373 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/27 ,  H01L2224/27426 ,  H01L2224/32058 ,  H01L2224/32245 ,  H01L2924/16235

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

公开(公告)号：US20200219785A1

公开(公告)日：2020-07-09

申请号：US16825905

申请日：2020-03-20

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Richard F. HILL

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/427 ,  B23P15/26

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

公开(公告)号：US20190013291A1

公开(公告)日：2019-01-10

申请号：US16114687

申请日：2018-08-28

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Michael S. WLADYKA ,  Keith David JOHNSON ,  Jingting YANG ,  Kevin Joel BOHRER ,  Mark D. KITTEL

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/373 ,  H01L23/367 ,  B32B37/00 ,  B32B38/00 ,  B32B38/06

Abstract: Disclosed are exemplary embodiments of systems and methods of applying materials to components. The materials may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU), etc.), heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.), etc.

公开(公告)号：US20250024654A1

公开(公告)日：2025-01-16

申请号：US18399085

申请日：2023-12-28

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER

IPC: H05K9/00 ,  C08K3/08 ,  C08K3/14 ,  C08K3/22 ,  C08L83/06 ,  C08L91/06

Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder.

公开(公告)号：US20220376322A1

公开(公告)日：2022-11-24

申请号：US17882328

申请日：2022-08-05

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  John SONG

IPC: H01M10/653 ,  C04B14/06 ,  H05K9/00 ,  H01M50/116 ,  H01M50/124

Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

公开(公告)号：US20190132994A1

公开(公告)日：2019-05-02

申请号：US16125361

申请日：2018-09-07

Applicant: Laird Technologies, Inc.

Inventor： Keith David JOHNSON ,  Douglas S. MCBAIN ,  Eugene Anthony PRUSS ,  Jason L. STRADER

IPC: H05K7/20 ,  H01R13/6581 ,  C09K5/14

Abstract: Exemplary embodiments are disclosed of thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components.

公开(公告)号：US20210368659A1

公开(公告)日：2021-11-25

申请号：US17327435

申请日：2021-05-21

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER

IPC: H05K9/00 ,  C08L83/06 ,  C08K3/08 ,  C08K3/14 ,  C08K3/22 ,  C08L91/06

Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder.

公开(公告)号：US20210202343A1

公开(公告)日：2021-07-01

申请号：US17197611

申请日：2021-03-10

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Richard F. HILL

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/427 ,  B23P15/26

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.