公开(公告)号：US20220122878A1

公开(公告)日：2022-04-21

申请号：US17605545

申请日：2020-04-22

Applicant: Lam Research Corporation

Inventor： Joanna Wu ,  Hui Ling Han ,  Christopher Kimball ,  Jim Tappan ,  Griff O'Neill ,  John Drewery

IPC: H01L21/687 ,  H01J37/20 ,  H01J37/32

Abstract: A lift pin mechanism employed within a process module includes a plurality of lift pins distributed uniformly along a circumference of a lower electrode defined in the process module. Each lift pin includes a top member that is separated from a bottom member by a collar defined by a chamfer. A sleeve is defined in a housing within a body of the lower electrode on which a substrate is received for processing. The housing is disposed below a mid ring that is defined in the lower electrode. The collar of the lift pin is used to engage with a bottom side of the sleeve, and a top side of the sleeve is configured to engage with the mid ring, when the lift pins are activated. An actuator coupled to each of the plurality of lift pins and an actuator drive connected to the actuators is used to drive the plurality of lift pins. A controller is coupled to the actuator drive to control movement of the plurality of lift pins.