公开(公告)号：US20240096713A1

公开(公告)日：2024-03-21

申请号：US18256665

申请日：2021-12-14

申请人： Lam Research Corporation

发明人： Yan Zhang ,  Ye Feng ,  Dipongkar Talukder ,  Jeffrey D. Bonde ,  Weng Foong Woo ,  Karthik Thimmavajjula ,  Jorge Luque

IPC分类号： H01L21/66 ,  G06N20/00 ,  H01L21/67

CPC分类号： H01L22/20 ,  G06N20/00 ,  H01L21/67253

摘要： Methods and systems for using a time-series of spectra to identify endpoint of a multi-step semiconductor fabrication processes such as multi-step deposition and multi-step etch processes. One method includes accessing a virtual carpet (e.g., a machine learning model) that is formed from a time-series of spectra for the multi-step processes collected during a training operation. During production, in-situ time-series of spectra are compared to the virtual carpet as part of end pointing of multi-step fabrication processes.