公开(公告)号：US10892197B2

公开(公告)日：2021-01-12

申请号：US16115627

申请日：2018-08-29

Applicant: Lam Research Corporation

Inventor： Keith William Gaff ,  Matthew Busche ,  Anthony Ricci ,  Henry S. Povolny ,  Scott Stevenot

IPC: H01J37/32 ,  H01L21/66 ,  H01L21/67

Abstract: A lower electrode assembly configured to support a semiconductor substrate in a plasma processing chamber includes a base plate, an upper plate above the base plate, and a mounting groove surrounding a bond layer located between the base plate and the upper plate. An edge seal including a compressible ring is mounted in the mounting groove such that the compressible ring is axially compressed between the upper plate and the base plate. At least one gas passage is in fluid communication with an annular space between the compressible ring and an inner wall of the mounting groove. The at least gas one passage extends through the base plate and includes a plurality of outlets in fluid communication with the annular space. In some examples, a backing seal may be located between the edge seal and an inner wall of the mounting groove.

公开(公告)号：US10141670B1

公开(公告)日：2018-11-27

申请号：US15681556

申请日：2017-08-21

Applicant: Lam Research Corporation

Inventor： Scott Stevenot

IPC: H01R13/24 ,  H01L21/683 ,  H01R13/17

Abstract: A substrate connector to provide a connection to a substrate during substrate processing includes a spring pin assembly defining a first contact and including a first groove. A retention spring clip includes a body arranged in the first groove and projections extending from the body. A second contact includes a body defining a second groove. The second contact is arranged around the first contact of the spring pin assembly. The projections of the retention spring clip extend into the second groove in the second contact.

公开(公告)号：US10090211B2

公开(公告)日：2018-10-02

申请号：US14141079

申请日：2013-12-26

Applicant: Lam Research Corporation

Inventor： Keith William Gaff ,  Matthew Busche ,  Anthony Ricci ,  Henry S. Povolny ,  Scott Stevenot

IPC: H01L21/67 ,  H01L21/66 ,  H01J37/32

Abstract: A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled base plate, an upper plate above the base plate, and an annular mounting groove surrounding a bond layer located between the base plate and the upper plate. The mounting groove includes an inner wall, an opening of the mounting groove faces radially outward relative to the inner wall, and the mounting groove includes a step extending downward from the upper plate on an upper wall of the groove or extending upward from the base plate on a lower wall of the groove. An edge seal including a compressible ring is mounted in the groove such that the compressible ring is compressed between the upper plate and the base plate to cause an outer surface of the compressible ring to be biased radially outward relative to the inner wall toward the step.

公开(公告)号：US20150187614A1

公开(公告)日：2015-07-02

申请号：US14141079

申请日：2013-12-26

Applicant: Lam Research Corporation

Inventor： Keith William Gaff ,  Matthew Busche ,  Anthony Ricci ,  Henry S. Povolny ,  Scott Stevenot

IPC: H01L21/67 ,  H01L21/66 ,  H01J37/32

CPC classification number: H01L22/26 ,  H01J37/32082 ,  H01J37/3244 ,  H01J37/32513 ,  H01J37/32522 ,  H01J37/32532 ,  H01L21/67069

Abstract: A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising a ring compressed in the groove. A gas source supplies inert gas to the groove and maintains the inert gas at a pressure of 100 mTorr to 100 Torr in the groove.

Abstract translation: 用于在等离子体处理室中支撑半导体衬底的下电极组件包括温度控制的下基板，上板，围绕结合层的安装槽和包括在槽中压缩的环的边缘密封。 气体源向凹槽供应惰性气体，并将惰性气体保持在槽中的100mTorr至100Torr的压力。