公开(公告)号：US20090250173A1

公开(公告)日：2009-10-08

申请号：US12098827

申请日：2008-04-07

申请人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

发明人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

IPC分类号： B32B37/10 ,  B32B37/12

CPC分类号： H01C17/065 ,  H05B2203/01 ,  Y10T29/49083 ,  Y10T156/10 ,  Y10T156/17

摘要： An apparatus for positioning a tape preform as a layer onto a substrate during the manufacture of a layered resistive device is provided. The apparatus includes at least one positioning member, wherein the positioning member defines a proximal end portion and a distal end portion. The apparatus also includes a contact member adapted to engage the tape preform against the substrate. The contact member and the distal end portion of the positioning member are configured to position the tape preform onto the substrate.

摘要翻译： 提供了一种用于在制造分层电阻性装置期间将带预制件作为层定位到基板上的装置。 该装置包括至少一个定位构件，其中定位构件限定近端部分和远端部分。 该装置还包括适于将带预制件接合在衬底上的接触构件。 定位构件的接触构件和远端部分构造成将带预制件定位到基底上。

公开(公告)号：US20100319186A1

公开(公告)日：2010-12-23

申请号：US12868456

申请日：2010-08-25

申请人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

发明人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

IPC分类号： H05B3/00

CPC分类号： H01C17/065 ,  H05B2203/01 ,  Y10T29/49083 ,  Y10T156/10 ,  Y10T156/17

摘要： A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform.

摘要翻译： 提供了在制造分层电阻性装置期间将带预制件定位为电阻器件基板上的方法。 该方法包括将带预制件定位在预定位置，并相对于彼此平移一个或多个下一个直到定位装置的一部分接合带预制件：定位装置，电阻装置基板和带预制件。 该方法还包括继续平移，直到带预成型件接合电阻器件衬底并且继续平移，使得定位装置的部件逐渐地在电阻器件衬底周围平移并随后将带预制件定位到电阻器件衬底上。 在一些形式中，该方法包括使用控制器和/或将温度，压力和时间的预定循环应用于基底和带预制件。

公开(公告)号：US08070899B2

公开(公告)日：2011-12-06

申请号：US12868456

申请日：2010-08-25

申请人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

发明人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

IPC分类号： B29C65/00 ,  B32B37/00 ,  B65H81/00

CPC分类号： H01C17/065 ,  H05B2203/01 ,  Y10T29/49083 ,  Y10T156/10 ,  Y10T156/17

摘要： A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform.

摘要翻译： 提供了在制造分层电阻性装置期间将带预制件定位为电阻器件基板上的方法。 该方法包括将带预制件定位在预定位置，并相对于彼此平移一个或多个下一个直到定位装置的一部分接合带预制件：定位装置，电阻装置基板和带预制件。 该方法还包括继续平移，直到带预成型件接合电阻器件衬底并且继续平移，使得定位装置的部件逐渐地在电阻器件衬底周围平移并随后将带预制件定位到电阻器件衬底上。 在一些形式中，该方法包括使用控制器和/或将温度，压力和时间的预定循环应用于基底和带预制件。