公开(公告)号：US07148083B2

公开(公告)日：2006-12-12

申请号：US10986424

申请日：2004-11-10

申请人： Larry Kinsman ,  Richard Wensel ,  Jeff Reeder

发明人： Larry Kinsman ,  Richard Wensel ,  Jeff Reeder

IPC分类号： H01L21/66 ,  H01L21/00

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.

公开(公告)号：US07095115B2

公开(公告)日：2006-08-22

申请号：US10610556

申请日：2003-07-02

申请人： Larry Kinsman ,  Richard Wensel ,  Jeff Reeder

发明人： Larry Kinsman ,  Richard Wensel ,  Jeff Reeder

IPC分类号： H01L23/06 ,  H01L23/22 ,  H01L23/24 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.

摘要翻译： 在一个实施方式中，电路基板包括具有相对侧的基板。 至少一个侧面被配置用于转移模具包装并且在其上形成导电迹线。 焊接掩模在一侧被接收，并且具有穿过其形成的多个开口穿过导电迹线上的位置。 所述焊接掩模包括位于所述一侧上的外围细长沟槽，以与所述一侧的转移模具包装用于转移模具的细长模具空隙周边的至少一部分对准。 在一个实施方案中，本发明包括转移模具半导体封装工艺。 在一个实现中，本发明包括半导体封装。 在一个实施方式中，本发明包括球栅阵列。

公开(公告)号：US20050101061A1

公开(公告)日：2005-05-12

申请号：US10986424

申请日：2004-11-10

申请人： Larry Kinsman ,  Richard Wensel ,  Jeff Reeder

发明人： Larry Kinsman ,  Richard Wensel ,  Jeff Reeder

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.

摘要翻译： 在一个实施方式中，电路基板包括具有相对侧的基板。 至少一个侧面被配置用于转移模具包装并且在其上形成导电迹线。 焊接掩模在一侧被接收，并且具有穿过其形成的多个开口穿过导电迹线上的位置。 所述焊接掩模包括位于所述一侧上的外围细长沟槽，以与所述一侧的转移模具包装用于转移模具的细长模具空隙周边的至少一部分对准。 在一个实施方案中，本发明包括转移模具半导体封装工艺。 在一个实现中，本发明包括半导体封装。 在一个实施方式中，本发明包括球栅阵列。

公开(公告)号：US07384805B2

公开(公告)日：2008-06-10

申请号：US10286658

申请日：2002-11-01

申请人： Larry Kinsman ,  Richard Wensel ,  Jeff Reeder

发明人： Larry Kinsman ,  Richard Wensel ,  Jeff Reeder

IPC分类号： H01L21/00 ,  H01L21/66

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.

摘要翻译： 在一个实施方式中，电路基板包括具有相对侧的基板。 至少一个侧面被配置用于转移模具包装并且在其上形成导电迹线。 焊接掩模在一侧被接收，并且具有穿过其形成的多个开口穿过导电迹线上的位置。 所述焊接掩模包括位于所述一侧上的外围细长沟槽，以与所述一侧的转移模具包装用于转移模具的细长模具空隙周边的至少一部分对准。 在一个实施方案中，本发明包括转移模具半导体封装工艺。 在一个实现中，本发明包括半导体封装。 在一个实施方式中，本发明包括球栅阵列。