摘要:
A radiation system includes a contamination barrier configured to permit radiation from a radiation source to pass through and to capture debris coming from the radiation source. The contamination barrier includes a plurality of lamellas. The surface of the lamellas includes a material. The radiation system also includes a collector configured to collect radiation from the contamination barrier. An optical surface of the collector includes a material that is the same as the material of the surface of the lamellas.
摘要:
A contamination barrier configured to permit radiation from a radiation source to pass through and to capture debris from the radiation source. The contamination barrier includes a support structure, a plurality of plate members arranged on the support structure and extending in a radial direction from an axis of the support structure, and a shield configured to block at least part of the support structure from being hit by radiation or debris from the radiation source.
摘要:
A radiation system includes a contamination barrier configured to permit radiation from a radiation source to pass through and to capture debris coming from the radiation source. The contamination barrier includes a plurality of lamellas. The surface of the lamellas includes a material. The radiation system also includes a collector configured to collect radiation from the contamination barrier. An optical surface of the collector includes a material that is the same as the material of the surface of the lamellas.
摘要:
A contamination barrier that passes through radiation from a radiation source and captures debris coming from the radiation source is disclosed. The contamination barrier includes an inner ring, an outer ring, and a plurality of lamellas. The lamellas extend in a radial direction from a main axis, and each of the lamellas is positioned in a respective plane that include the main axis. At least one outer end of each of the lamellas is slidably connected to at least one of the inner and outer ring.
摘要:
A cleaning arrangement for a lithographic apparatus module may be provided in a collector. The cleaning arrangement includes a hydrogen radical source configured to provide a hydrogen radical containing gas to at least part of the module and a pump configured to pump gas through the module such that a flow speed of the hydrogen radical containing gas provided through at least part of the module is at least 1 m/s. The cleaning arrangement may also include a gas shutter configured to modulate a flow of the hydrogen radical containing gas to at least part of the module, a buffer volume of at least 1 m3 in communication with the module, and a pump configured to provide a gas pressure in the buffer volume between 0.001 mbar (0.1 Pa) and 1 mbar (100 Pa).
摘要:
A cleaning arrangement for a lithographic apparatus module may be provided in a collector. The cleaning arrangement includes a hydrogen radical source configured to provide a hydrogen radical containing gas to at least part of the module and a pump configured to pump gas through the module such that a flow speed of the hydrogen radical containing gas provided through at least part of the module is at least 1 m/s. The cleaning arrangement may also include a gas shutter configured to modulate a flow of the hydrogen radical containing gas to at least part of the module, a buffer volume of at least 1 m3 in communication with the module, and a pump configured to provide a gas pressure in the buffer volume between 0.001 mbar (0.1 Pa) and 1 mbar (100 Pa). The cleaning arrangement may further include a gas return system.
摘要:
A cleaning arrangement for a lithographic apparatus module may be provided in a collector. The cleaning arrangement includes a hydrogen radical source configured to provide a hydrogen radical containing gas to at least part of the module and a pump configured to pump gas through the module such that a flow speed of the hydrogen radical containing gas provided through at least part of the module is at least 1 m/s. The cleaning arrangement may also include a gas shutter configured to modulate a flow of the hydrogen radical containing gas to at least part of the module, a buffer volume of at least 1 m3 in communication with the module, and a pump configured to provide a gas pressure in the buffer volume between 0.001 mbar (0.1 Pa) and 1 mbar (100 Pa). The cleaning arrangement may further include a gas return system.