公开(公告)号：US09245877B2

公开(公告)日：2016-01-26

申请号：US14305071

申请日：2014-06-16

Applicant: Lextar Electronics Corporation

Inventor： Bo-Yu Ko ,  Yee-Cheng Chang ,  Chun-Wei Wang

IPC: H01L33/62 ,  H01L25/16

CPC classification number: H01L25/167 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A LED device is provided. The LED comprises a frame, a housing, a LED chip and a protection component. The frame comprises a first lead frame and a second lead frame disposed along a first direction and isolated from each other. The housing partially covers the first and second lead frames, and has a receiving portion exposing parts of the surfaces of the first and second lead frames. The LED chip is disposed in the receiving portion on the exposed surface of the first lead frame, and electrically connected to the first and second lead frames. The protection component is disposed on a surface of the second lead frame that is covered by the housing and electrically connected to the first lead frame. None of the sides of a vertical projection of the protection component on the second lead frame is parallel or perpendicular to the first direction.

Abstract translation: 提供LED装置。 LED包括框架，壳体，LED芯片和保护部件。 框架包括沿着第一方向设置并彼此隔离的第一引线框架和第二引线框架。 壳体部分地覆盖第一和第二引线框架，并且具有暴露第一引线框架和第二引线框架的表面的部分的接收部分。 LED芯片设置在第一引线框架的暴露表面上的接收部分中，并且电连接到第一引线框架和第二引线框架。 保护部件设置在第二引线框架的被外壳覆盖并与第一引线框架电连接的表面上。 保护部件在第二引线框架上的垂直投影的一侧不平行或垂直于第一方向。

公开(公告)号：US20150207049A1

公开(公告)日：2015-07-23

申请号：US14305071

申请日：2014-06-16

Applicant: Lextar Electronics Corporation

Inventor： Bo-Yu Ko ,  Yee-Cheng Chang ,  Chun-Wei Wang

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/50 ,  H01L27/15

CPC classification number: H01L25/167 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A LED device is provided. The LED comprises a frame, a housing, a LED chip and a protection component. The frame comprises a first lead frame and a second lead frame disposed along a first direction and isolated from each other. The housing partially covers the first and second lead frames, and has a receiving portion exposing parts of the surfaces of the first and second lead frames. The LED chip is disposed in the receiving portion on the exposed surface of the first lead frame, and electrically connected to the first and second lead frames. The protection component is disposed on a surface of the second lead frame that is covered by the housing and electrically connected to the first lead frame. None of the sides of a vertical projection of the protection component on the second lead frame is parallel or perpendicular to the first direction.

Abstract translation: 提供LED装置。 LED包括框架，壳体，LED芯片和保护部件。 框架包括沿着第一方向设置并彼此隔离的第一引线框架和第二引线框架。 壳体部分地覆盖第一和第二引线框架，并且具有暴露第一引线框架和第二引线框架的表面的部分的接收部分。 LED芯片设置在第一引线框架的暴露表面上的接收部分中，并且电连接到第一引线框架和第二引线框架。 保护部件设置在第二引线框架的被外壳覆盖并与第一引线框架电连接的表面上。 保护部件在第二引线框架上的垂直投影的一侧不平行或垂直于第一方向。