公开(公告)号：US06568464B1

公开(公告)日：2003-05-27

申请号：US10099571

申请日：2002-03-14

申请人： Li He ,  Tsung-Lung Lee ,  Cheng-Tien Lai

发明人： Li He ,  Tsung-Lung Lee ,  Cheng-Tien Lai

IPC分类号： F28F700

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink clip assembly for attaching a heat sink (10) to a CPU (60) mounted to a motherboard (50). The heat sink clip assembly includes two bolts (40), and two wire clips (30). Two screw holes (16) are defined in opposite side faces of the heat sink. Each bolt includes a pole (44), a head (42), and a threaded end (46). Each clip has a coiled portion (32), and two spring arms (34) extending from opposite ends of the coiled portion. The coiled portions of the clips are respectively placed over the poles of the bolts. The threaded ends of the bolts are screwed into the screw holes; thus, each clip is retained between the head of a corresponding bolt and a side face of the heat sink. A hook (36) is formed on each spring arm, for engaging in a corresponding through hole (52) of the motherboard.

摘要翻译： 一种用于将散热器（10）附接到安装到母板（50）的CPU（60）的散热片夹组件。 散热器夹组件包括两个螺栓（40）和两个线夹（30）。 两个螺钉孔（16）被限定在散热器的相对侧面。 每个螺栓包括杆（44），头（42）和螺纹端（46）。 每个夹子具有螺旋部分（32）和从螺旋部分的相对端延伸的两个弹簧臂（34）。 夹子的螺旋部分分别放置在螺栓的极上。 螺栓的螺纹端拧入螺丝孔; 因此，每个夹子保持在相应螺栓的头部和散热器的侧面之间。 在每个弹簧臂上形成一个钩（36），用于啮合主板的对应通孔（52）。

公开(公告)号：US06538891B1

公开(公告)日：2003-03-25

申请号：US10081640

申请日：2002-02-21

申请人： Li He ,  Tsung-Lung Lee ,  Cheng-Tien Lai

发明人： Li He ,  Tsung-Lung Lee ,  Cheng-Tien Lai

IPC分类号： H05K720

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink clip assembly for attaching a heat sink (30) to a CPU (40) mounted to a motherboard (50) includes a rigid shaft (10) and two wire clips (20). The shaft includes a pressing section (12) for pressing the heat sink, two engaging sections (14) at opposite ends of the pressing section, and two stop sections (16) at outmost ends of the engaging sections. A diameter of the engaging sections is less than diameters of the pressing section and the stop sections. Each wire clip has a coiled portion (22), and two spring arms (24) extending from opposite ends of the coiled portion. Each spring arm extends perpendicularly to a central axis of the coiled portion. A hook (26) is formed at a distal end of each spring arm, for engaging with a corresponding through hole (52) of the motherboard. The heat sink is thereby attached to the motherboard.

摘要翻译： 用于将散热器（30）附接到安装到母板（50）的CPU（40）的散热片夹组件包括刚性轴（10）和两个线夹（20）。 所述轴包括用于按压所述散热器的按压部分（12），在所述按压部分的相对端处的两个接合部分（14）和在所述接合部分的最外端的两个停止部分（16）。 接合部的直径小于按压部和止挡部的直径。 每个线夹具有螺旋部分（22）和从螺旋部分的相对端延伸的两个弹簧臂（24）。 每个弹簧臂垂直于螺旋部分的中心轴线延伸。 在每个弹簧臂的远端处形成有钩子（26），用于与主板的对应的通孔（52）接合。 因此散热器附着在主板上。

公开(公告)号：US07484553B2

公开(公告)日：2009-02-03

申请号：US10144126

申请日：2002-05-10

申请人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

发明人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

IPC分类号： F28D15/00

CPC分类号： F28D15/0233 ,  F28D15/04

摘要： A heat pipe includes an outer pipe (10), an inner pipe (20), and a hermetic cap (30). The outer pipe has an evaporating end (12) and a condensing end (14). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap (40) is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

摘要翻译： 热管包括外管（10），内管（20）和密封帽（30）。 外管具有蒸发端（12）和冷凝端（14）。 蒸发端整体密封并接收工作流体。 内管包括敞开的顶部和敞开的底部。 在内管和外管之间限定非常窄的间隙（40）。 将多个颗粒放入间隙中以形成多孔芯吸结构。 当蒸发端被外部热源加热时，工作流体被蒸发并沿着内管向上流动到冷凝端。 工作流体在冷凝端冷凝，并通过间隙回流到蒸发端。 由于间隙非常窄，工作流体的表面张力和外管和内管的毛细作用增强。

公开(公告)号：US06736196B2

公开(公告)日：2004-05-18

申请号：US10116308

申请日：2002-04-03

申请人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shuai Jiang

发明人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shuai Jiang

IPC分类号： H05K720

CPC分类号： H05K7/20172

摘要： A fan duct assembly includes a base (1), a first plate (20), a second plate (30) pivotably connected to the first plate, a connection member (40) pivotably connected to the second plate, and a fan cover (70) connected with the connection member. The base is mounted over a heat sink, and includes a pair of side panels (3). Each side panel has a horizontal portion (7), a slant portion (9) and a vertical portion (11). The horizontal portions, slant portions and vertical portions define a pair of locking apertures (13), respectively. The connection member has a pair of latches (52). The latches can be selectively engaged in any one pair of the locking apertures and orientations of the plates can be varied. Accordingly, outside cooling air from the fan cover can be guided through the connection member to the heat sink from a variety of directions.

摘要翻译： 一种风扇管道组件，包括基座（1），第一板（20），可枢转地连接到第一板的第二板（30），可枢转地连接到第二板的连接构件（40）和风扇罩 ）与连接构件连接。 基座安装在散热器上，并包括一对侧板（3）。 每个侧板具有水平部分（7），倾斜部分（9）和垂直部分（11）。 水平部分，倾斜部分和垂直部分分别限定一对锁定孔（13）。 连接构件具有一对闩锁（52）。 闩锁可以选择性地接合在任何一对锁定孔中，并且可以改变板的取向。 因此，来自风扇盖的外部冷却空气可以从各种方向被引导通过连接构件到散热器。

公开(公告)号：US06650543B2

公开(公告)日：2003-11-18

申请号：US10122098

申请日：2002-04-12

申请人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

发明人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

IPC分类号： H05K720

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a vaporizing portion (10), a condensing portion (20), and a pair of pipes (50a, 50b). The vaporizing portion is attached to a heat-generating electronic chip (40) and contains liquid having great heat conductivity. The condensing portion receives vapor from the vaporizing portion, and cools the vapor to back to liquid form. The pipes are engaged with the vaporizing portion and the condensing portion, thus forming a circulatory route for the vapor from the vaporizing portion to the condensing portion, and for the liquid from the condensing portion to the vaporizing portion.

摘要翻译： 散热装置包括蒸发部分（10），冷凝部分（20）和一对管道（50a，50b）。 汽化部分附着在发热电子芯片（40）上，并含有导热性好的液体。 冷凝部分接收蒸发部分的蒸汽，并将蒸汽冷却回液体。 管道与蒸发部分和冷凝部分接合，从而形成用于从蒸发部分到冷凝部分的蒸汽的循环路线，以及用于从冷凝部分到蒸发部分的液体。

公开(公告)号：US06480387B1

公开(公告)日：2002-11-12

申请号：US10099826

申请日：2002-03-14

申请人： Tsung-Lung Lee ,  Cheng-Tien Lai ,  Zili Zhang

发明人： Tsung-Lung Lee ,  Cheng-Tien Lai ,  Zili Zhang

IPC分类号： H05H720

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  Y10T24/42 ,  H01L2924/00

摘要： A heat sink assembly includes a heat sink (10), a plurality of standoffs (20), and a plurality of springs (40). The heat sink includes a base (12) defining a plurality of through apertures (16). Each standoff includes a head (24), and a body (22) extending through a corresponding through aperture. The springs are placed over the corresponding bodies and located between the heads and the base. The body has a hollow part (26) for fixedly receiving a bolt (45). The hollow part includes an expandable portion (28) at a bottom end thereof, a smooth guiding portion (31) above the expandable portion, and a threaded portion (33) above the guiding portion. The guiding portion guides the bolt in the standoff to facilitate the bolt engaging in the threaded portion. The expandable portions are expanded to thereby combine the heat sink, standoffs and springs as a single unit.

摘要翻译： 散热器组件包括散热器（10），多个支座（20）和多个弹簧（40）。 散热器包括限定多个通孔（16）的基座（12）。 每个支座包括头部（24）和延伸通过对应的通孔的主体（22）。 弹簧放置在相应的主体上方并位于头部和底座之间。 主体具有用于固定地接收螺栓（45）的中空部分（26）。 中空部分包括在其底端处的可膨胀部分（28），在可膨胀部分上方的平滑引导部分（31）和在引导部分上方的螺纹部分（33）。 引导部分将螺栓引导到支座中以便于螺栓接合在螺纹部分中。 可膨胀部分被膨胀，从而将散热器，支座和弹簧组合为一个单元。

公开(公告)号：US06808013B2

公开(公告)日：2004-10-26

申请号：US10174770

申请日：2002-06-18

申请人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

发明人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

IPC分类号： F28F700

CPC分类号： F28F7/02 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2021/0029 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device (1) includes a heat sink (12), a number of first pipes (14), a pair of second pipes (16), and working liquid. The heat sink includes a base (122), and a number of fins (124) attached on the base. A number of parallel first holes (126) is defined through the base. A second hole (128) is defined through a middle of the base in a longitudinal direction that is perpendicular to the first holes. The first and second pipes and the first and second holes thus cooperatively form a closed circulatory route. The working liquid is received in the circulatory route. In operations the working liquid absorbs heat at the base and circulates through the circulatory route. The first and second pipes dissipate said heat to airspace beyond the fins. Accordingly, the first and second pipes increase a heat dissipation area of the heat dissipation device.

摘要翻译： 散热装置（1）包括散热器（12），多个第一管（14），一对第二管（16）和工作液体。 散热器包括基座（122）和附接在基座上的多个散热片（124）。 通过基座限定多个平行的第一孔（126）。 第二孔（128）通过垂直于第一孔的纵向的基部的中部限定。 第一和第二管道以及第一和第二孔因此协同地形成封闭的循环路线。 工作液体在循环路线中接收。 在操作中，工作液体吸收底部的热量并循环通过循环路线。 第一和第二管道将所述热量散发到翅片之外的空域。 因此，第一和第二管道增加了散热装置的散热面积。

公开(公告)号：US06480388B1

公开(公告)日：2002-11-12

申请号：US10103004

申请日：2002-03-20

申请人： Tsung-Lung Lee ,  Cheng-Tien Lai ,  Zili Zhang

发明人： Tsung-Lung Lee ,  Cheng-Tien Lai ,  Zili Zhang

IPC分类号： H05K720

CPC分类号： H01L23/36 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/1007 ,  H01L2924/00

摘要： A back plate assembly includes a back plate (40) for being attached to an underside of a motherboard (20), a plurality of posts (60), and a plurality of clips (80). The motherboard defines a plurality of through apertures (22). The back plate defines a plurality of through holes (48). Each clip defines a star-shaped cutout (82) in a middle of a round base (82) thereof, to thereby form a plurality of inwardly extending resilient teeth (84). The teeth slant upwardly from a periphery of the base toward a middle of the cutout. In assembly, the posts are extended through the corresponding through holes and through apertures. The clips are then placed on top ends of the posts and downwardly pushed until the clips abut the motherboard. The teeth are elastically deformed to thereby securely retain the posts in the motherboard. The back plate is thus securely attached to the motherboard.

摘要翻译： 背板组件包括用于附接到母板（20）的下侧的后板（40），多个柱（60）和多个夹子（80）。 主板限定多个通孔（22）。 后板限定多个通孔（48）。 每个夹子在其圆形基部（82）的中间限定了星形切口（82），从而形成多个向内延伸的弹性齿（84）。 齿从基部的周边朝切口的中间向上倾斜。 在组装中，柱通过相应的通孔延伸穿过孔。 然后将夹子放置在柱的顶端并向下推动直到夹子抵靠主板。 牙齿弹性变形，从而可靠地将柱固定在母板上。 因此，背板牢固地附接到母板。

公开(公告)号：US07543630B2

公开(公告)日：2009-06-09

申请号：US11430504

申请日：2006-05-08

申请人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

发明人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

IPC分类号： F28D15/04

CPC分类号： F28D15/0233 ,  F28D15/04

摘要： A heat pipe includes an outer pipe (10), an inner pipe (20), and a hermetic cap (30). The outer pipe has an evaporating end (12) and a condensing end (14). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap (40) is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

公开(公告)号：US06657863B2

公开(公告)日：2003-12-02

申请号：US10137778

申请日：2002-05-01

申请人： Tsung-Lung Lee ,  Shuai Jiang ,  Cheng-Tien Lai

发明人： Tsung-Lung Lee ,  Shuai Jiang ,  Cheng-Tien Lai

IPC分类号： H05K720

CPC分类号： H05K7/20172 ,  F04D29/441

摘要： A fan duct assembly (10) includes a fan duct (20) and a fan (30). The fan duct is connected between a heat sink (50) and a computer casing (40). The heat sink is mounted on a heat-generating electronic device (60) accommodated in the computer casing. The fan duct is made of hard plastic material, and can therefore maintain its shape. The fan duct includes first and second flues (22, 24) oriented substantially perpendicular to each other. The fan is secured in the duct at a junction of the first and second flues. Thus, the fan duct assembly provides a passageway for air to travel between the heat sink and an exterior of the computer casing.

摘要翻译： 风扇管道组件（10）包括风扇管道（20）和风扇（30）。 风扇管道连接在散热器（50）和计算机外壳（40）之间。 散热器安装在容纳在计算机外壳中的发热电子设备（60）上。 风扇导管由硬塑料制成，因此可保持其形状。 风扇管道包括基本上彼此垂直定向的第一和第二烟道（22,24）。 风扇在第一和第二个烟道的交界处固定在管道中。 因此，风扇管道组件提供用于空气在散热器和计算机外壳的外部之间行进的通道。