Dielectric gap material for magnetoresistive heads with conformal step coverage
    1.
    发明授权
    Dielectric gap material for magnetoresistive heads with conformal step coverage 有权
    用于具有保形台阶覆盖的磁阻头的介质间隙材料

    公开(公告)号:US06449132B1

    公开(公告)日:2002-09-10

    申请号:US09522517

    申请日:2000-03-10

    IPC分类号: G11B539

    CPC分类号: G11B5/3903 G11B5/3109

    摘要: A silicon nitride dielectric film for use in an MR head according to the present invention comprises from about 38% to 44% by volume of Si, from about 35% to 37% by volume of N, and from about 21% to 24% by volume of H. The dielectric film is formed by plasma enhanced chemical vapor deposition (PECVD) at relatively low temperatures. A plurality of gases capable of reacting to form silicon nitride are introduced into a PECVD reactor. An electric field is generated in the reactor to produce a plasma. The gases in the reactor react in the presence of the electrical field to form a silicon nitride dielectric film.

    摘要翻译: 根据本发明的用于MR磁头的氮化硅电介质膜包含约38%至44体积%的Si,约35%至37体积%的N和约21%至24%的 电介质膜通过等离子体增强化学气相沉积(PECVD)在较低温度下形成。 将能够反应形成氮化硅的多种气体引入PECVD反应器。 在反应器中产生电场以产生等离子体。 反应器中的气体在存在电场的情况下反应形成氮化硅电介质膜。