公开(公告)号：US20160278240A1

公开(公告)日：2016-09-22

申请号：US15169827

申请日：2016-06-01

Applicant: Lockheed Martin Corporation

Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20563 ,  B23P15/26 ,  H05K7/20272 ,  H05K7/2039 ,  H05K7/20763 ,  Y10T29/4935

Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

公开(公告)号：US10362713B2

公开(公告)日：2019-07-23

申请号：US15169827

申请日：2016-06-01

Applicant: Lockheed Martin Corporation

Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

IPC: H05K7/20 ,  B23P15/26

Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

公开(公告)号：US09426931B2

公开(公告)日：2016-08-23

申请号：US14175377

申请日：2014-02-07

Applicant: Lockheed Martin Corporation

Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20563 ,  B23P15/26 ,  H05K7/20272 ,  H05K7/2039 ,  H05K7/20763 ,  Y10T29/4935

Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

Abstract translation: 用于传导冷却卡组件的公开的装置可以包括框架，该框架包括适于接合用于至少一个电路卡的导电冷却框架的相对侧上的相应热管理接口的第一和第二导热部分。 该装置还可以包括在框架中在第一和第二开口之间延伸的通道，以便使冷却流体流入第一开口，通过该通道，并流出第二开口。 根据所公开的方法，插入件可以安装在夹层连接器的部件之间，以便增加连接器的高度。 在一些实施方式中，可以在夹层连接器的第一和第二部件分别安装在主机卡和夹层卡上的同时执行插入件的安装，使得插入件在第一和第二部件之间的安装增加间隔 主机卡和夹层卡之间。

公开(公告)号：US20150230365A1

公开(公告)日：2015-08-13

申请号：US14175377

申请日：2014-02-07

Applicant: Lockheed Martin Corporation

Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20563 ,  B23P15/26 ,  H05K7/20272 ,  H05K7/2039 ,  H05K7/20763 ,  Y10T29/4935

Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

Abstract translation: 用于传导冷却卡组件的公开的装置可以包括框架，该框架包括适于接合用于至少一个电路卡的导电冷却框架的相对侧上的相应热管理接口的第一和第二导热部分。 该装置还可以包括在框架中在第一和第二开口之间延伸的通道，以便使冷却流体流入第一开口，通过该通道，并流出第二开口。 根据所公开的方法，插入件可以安装在夹层连接器的部件之间，以便增加连接器的高度。 在一些实施方式中，可以在夹层连接器的第一和第二部件分别安装在主机卡和夹层卡上的同时执行插入件的安装，使得插入件在第一和第二部件之间的安装增加间隔 主机卡和夹层卡之间。

公开(公告)号：US10548243B2

公开(公告)日：2020-01-28

申请号：US15169869

申请日：2016-06-01

Applicant: Lockheed Martin Corporation

Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

IPC: H05K7/20 ,  B23P15/26

Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

公开(公告)号：US20160278241A1

公开(公告)日：2016-09-22

申请号：US15169869

申请日：2016-06-01

Applicant: Lockheed Martin Corporation

Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

IPC: H05K7/20

CPC classification number: H05K7/20563 ,  B23P15/26 ,  H05K7/20272 ,  H05K7/2039 ,  H05K7/20763 ,  Y10T29/4935

Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.