摘要:
An apparatus includes an equipment chassis configured to house electronic circuitry and to be inserted in an equipment rack between an opposed pair of rails. The equipment chassis includes a bottom face configured to rest on shelf members of the rails. The apparatus further includes a retaining bracket disposed at a side face of the equipment chassis facing one of the rails and oriented substantially perpendicular to the bottom face of the equipment chassis. The retaining bracket is configured to engage a horizontal groove in the one of the rails when the equipment chassis is inserted horizontally into the equipment rack between the rails. The retaining bracket may be configured to engage the one of the rails to limit vertical movement of the equipment chassis.
摘要:
An apparatus includes an equipment chassis configured to house electronic circuitry and to be inserted in an equipment rack between an opposed pair of rails. The equipment chassis includes a bottom face configured to rest on shelf members of the rails. The apparatus further includes a retaining bracket disposed at a side face of the equipment chassis facing one of the rails and oriented substantially perpendicular to the bottom face of the equipment chassis. The retaining bracket is configured to engage a horizontal groove in the one of the rails when the equipment chassis is inserted horizontally into the equipment rack between the rails. The retaining bracket may be configured to engage the one of the rails to limit vertical movement of the equipment chassis.
摘要:
The present disclosure relates to a heat transfer bracket that is configured to mount to a lighting fixture, which includes a heat spreading structure that is formed from a material that efficiently conducts heat and a light source and control electronics that are thermally coupled to the heat spreading structure. The heat transfer bracket includes a base that is thermally coupled to the heat spreading structure of the lighting fixture and multiple petals that extend from the base, wherein heat generated from the light source and control electronics is transferred to the heat spreading structure and from the heat spreading structure to the base of the heat transfer bracket. The heat is then further transferred along the plurality of petals.
摘要:
A lamp comprises an LED assembly comprising at least a first LED operable to emit light. A heat sink for dissipating heat from the LED assembly comprises an active element and a passive heat conductive element. The active element may comprise a fan that forces air over the passive heat conducting element.
摘要:
A thermal isolation arrangement for an LED lamp is disclosed. Embodiments of the invention provide thermal isolation between the power supply and the LED assembly of an LED lamp, in most cases allowing the power supply to operate in a lower temperature range than would otherwise be possible. At least one contact feature is provided between the power supply and the LED assembly to maintain a thermal transfer gap between the power supply and the LED assembly. A contact feature can be, for example, a triangular ridge or a conical protrusion. In some embodiments, a thermal isolation device provides the contact feature or contact features. An LED lamp according to example embodiments of the invention can have a modular design and/or can include an Edison base and/or an optical element or optical elements disposed to emit light from the LED lamp.
摘要:
A thermal isolation arrangement for an LED lamp is disclosed. Embodiments of the invention provide thermal isolation between the power supply and the LED assembly of an LED lamp, in most cases allowing the power supply to operate in a lower temperature range than would otherwise be possible. At least one contact feature is provided between the power supply and the LED assembly to maintain a thermal transfer gap between the power supply and the LED assembly. A contact feature can be, for example, a triangular ridge or a conical protrusion. In some embodiments, a thermal isolation device provides the contact feature or contact features. An LED lamp according to example embodiments of the invention can have a modular design and/or can include an Edison base and/or an optical element or optical elements disposed to emit light from the LED lamp.
摘要:
Lamps and bulbs are disclosed generally comprising different combinations and arrangement of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. Additionally, this arrangement allows aesthetic masking or concealment of the appearance of the conversion regions or layers when the lamp is not illuminated. Some embodiments of the present invention utilize LED chips to provide one or more lighting components instead of providing the components through phosphor conversion. This can provide for lamps that can be operated with lower power and can be manufactured at lower cost. In one embodiment, a red lighting component can be provided by red emitting LEDs as opposed to a red conversion material.