Dual purpose input electrode structure for MIOCs (multi-function
integrated optics chips)
    1.
    发明授权
    Dual purpose input electrode structure for MIOCs (multi-function integrated optics chips) 失效
    用于MIOC的双用途输入电极结构(多功能集成光学芯片)

    公开(公告)号:US6128424A

    公开(公告)日:2000-10-03

    申请号:US124457

    申请日:1998-07-28

    IPC分类号: G02B6/12 G02F1/035 G02F1/313

    摘要: An Integrated Optics Chip with improved performance when exposed to rapidly changing temperature is disclosed. The optic chip or integrated optic chip or MIOC has a top surface, a +Z face and -Z face. The chip is formed from a crystal having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face. An input waveguide formed in the top surface of the chip and orthogonal to the +Z axis receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. Metalization is applied to the top face of the optic chip to form at least a first and a second rail. The first and second rails are positioned to very closely straddle a portion of the input waveguide. A conductive bridge connects the first and second rails to prevent a charge differential from developing between the first and second rails.

    摘要翻译: 公开了当暴露于快速变化的温度时具有改进的性能的集成光学芯片。 光学芯片或集成光学芯片或MIOC具有顶面,+ Z面和-Z面。 芯片由具有高电光系数的晶体形成,例如铌酸锂。 为了将组件定向到要描述的光学芯片,+ Z晶体轴从+ Z面向外延伸。 形成在芯片的顶表面并与+ Z轴正交的输入波导接收来自输入端口的光信号,将信号经由波导网络传递到将波导网络耦合到输出端口的输出波导。 将金属化施加到光学芯片的顶面以形成至少第一和第二导轨。 第一和第二轨道定位成非常紧密地跨越输入波导的一部分。 导电桥连接第一和第二导轨,以防止电荷差异在第一和第二导轨之间形成。

    Multifunction integrated optics chip having improved polarization extinction ratio
    2.
    发明授权
    Multifunction integrated optics chip having improved polarization extinction ratio 有权
    具有改善的偏振消光比的多功能集成光学芯片

    公开(公告)号:US06351575B1

    公开(公告)日:2002-02-26

    申请号:US09469665

    申请日:1999-12-23

    IPC分类号: G02B612

    CPC分类号: G02B6/126 G02B6/122

    摘要: An integrated optics chip includes an optical waveguide network formed on a surface of an electrooptically active material. The optical waveguide network has an input facet where an optical signal may be input to the optical waveguide network and an output facet where optical signals may be output from the optical waveguide network. One or more trenches is formed in the bottom surface of the surface and arranged to extend into the substrate toward the optical waveguide network to a depth of at least 70% of the thickness. The trenches prevent light rays incident thereon from inside the substrate from propagating to the output facet. In particular, the trenches prevent light scattered at the input facet or from scattering centers in the optical waveguide network from reflecting from the bottom surface of the substrate to the output facet. A cover may be mounted to the top surface of the substrate to provide structural strength to the integrated optics chip. The cover preferably extends substantially the entire length of the substrate. One or more side grooves may be formed in the sides of the substrate and cover. A light absorbing material may be placed in the trenches and grooves. An electrode pattern may be formed on the top surface of the substrate adjacent the optical waveguide network, and a plurality of access electrodes may be formed on sides of the substrate and cover to provide electrical signals to the electrodes.

    摘要翻译: 集成光学芯片包括形成在电光活性材料的表面上的光波导网络。 光波导网络具有可以将光信号输入到光波导网络的输入小面和可以从光波导网络输出光信号的输出小面。 一个或多个沟槽形成在表面的底表面中,并布置成朝向光波导网络延伸到衬底的至少70%厚度的深度。 沟槽防止从衬底内部入射到其上的光线传播到输出小面。 特别地,沟槽防止在输入小面处散射的光或光波导网络中的散射中心从基板的底表面反射到输出小面。 盖可以安装到基板的顶表面以向集成光学芯片提供结构强度。 盖优选地基本上延伸到基板的整个长度上。 可以在基板和盖的侧面中形成一个或多个侧槽。 光吸收材料可以放置在沟槽和沟槽中。 可以在邻近光波导网络的基板的顶表面上形成电极图案,并且可以在基板和盖的侧面上形成多个接入电极,以向电极提供电信号。

    Lateral trenching for cross coupling suppression in integrated optics chips
    4.
    发明授权
    Lateral trenching for cross coupling suppression in integrated optics chips 有权
    集成光学芯片中交叉耦合抑制的横向挖沟

    公开(公告)号:US06418246B1

    公开(公告)日:2002-07-09

    申请号:US09471720

    申请日:1999-12-23

    申请人: Lorrie L. Gampp

    发明人: Lorrie L. Gampp

    IPC分类号: G02B612

    CPC分类号: G02B6/126 G02B6/122

    摘要: An optical waveguide network is formed in a substrate of an electrooptically active material. The optical waveguide has input and output facets where optical signals may be input to and output from the integrated optics chip. At least one lateral trench is formed in the substrate. The lateral trench is arranged to prevent light rays incident thereon from inside the substrate from propagating to the output facet. The lateral trench may be formed as a slot that extends toward the surface of the substrate where the optical waveguide network is formed, or the trench may be parallel to the plane of the optical waveguides. The trench may be formed in a surface that is either parallel or perpendicular to the plane of he optical waveguide network,

    摘要翻译: 光电波导网络形成在电光活性材料的基片中。 光波导具有输入和输出面,其中光信号可以被输入到集成光学芯片并从其输出。 在衬底中形成至少一个横向沟槽。 横向沟槽布置成防止从衬底内部入射到其上的光线传播到输出小面。 横向沟槽可以形成为朝向衬底的形成光波导网络的表面延伸的槽,或者沟槽可以平行于光波导的平面。 沟槽可以形成在与光波导网络的平面平行或垂直的表面中,