公开(公告)号：US20130249589A1

公开(公告)日：2013-09-26

申请号：US13619528

申请日：2012-09-14

申请人： Lu-Yi Chen ,  Chi-Hsin Chiu ,  Shih-Kuang Chiu

发明人： Lu-Yi Chen ,  Chi-Hsin Chiu ,  Shih-Kuang Chiu

IPC分类号： H01L23/495 ,  G01R31/26

CPC分类号： H01L22/14 ,  H01L21/486 ,  H01L22/20 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16

摘要： An interposer is provided which includes: a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the first surface, the second surface having a plurality of second conductive pads; a plurality of conductive through holes penetrating the first and second surfaces of the substrate and electrically connecting the first and second conductive pads; and a first removable electrical connection structure formed on the first surface and electrically connecting a portion of the first conductive pads so as to facilitate electrical testing of the interposer.

摘要翻译： 提供了一种内插器，其包括：具有第一表面的基板，具有多个第一导电焊盘和与该第一表面相对的第二表面，该第二表面具有多个第二导电焊盘; 穿过基片的第一和第二表面并电连接第一和第二导电垫的多个导电通孔; 以及形成在所述第一表面上并电连接所述第一导电焊盘的一部分以便于所述插入器的电测试的第一可移除电连接结构。

公开(公告)号：US09991178B2

公开(公告)日：2018-06-05

申请号：US13619528

申请日：2012-09-14

申请人： Lu-Yi Chen ,  Chi-Hsin Chiu ,  Shih-Kuang Chiu

发明人： Lu-Yi Chen ,  Chi-Hsin Chiu ,  Shih-Kuang Chiu

IPC分类号： H01L21/66 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L22/14 ,  H01L21/486 ,  H01L22/20 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16

摘要： An interposer is provided which includes: a substrate having a first surface with a plurality of first conductive pads and a second surface opposite to the first surface, the second surface having a plurality of second conductive pads; a plurality of conductive through holes penetrating the first and second surfaces of the substrate and electrically connecting the first and second conductive pads; and a first removable electrical connection structure formed on the first surface and electrically connecting a portion of the first conductive pads so as to facilitate electrical testing of the interposer.