公开(公告)号：US20200303450A1

公开(公告)日：2020-09-24

申请号：US16894449

申请日：2020-06-05

申请人： Lumileds Holding B.V.

发明人： Hisashi MASUI ,  Ken SHIMIZU ,  Emma DOHNER

IPC分类号： H01L27/15 ,  H01L33/60 ,  H01L33/50

摘要： The pcLED pixels in a phosphor-converted LED array each comprise an optical element on the light-emitting surface above the phosphor layer. In methods for making such pixelated LED arrays, a thin layer of a sacrificial phosphor carrier substrate is retained as the optical element on the output surface of the phosphor pixels upon completion of the fabrication process.

公开(公告)号：US20200212101A1

公开(公告)日：2020-07-02

申请号：US16358092

申请日：2019-03-19

申请人： Lumileds Holding B.V.

发明人： Hisashi MASUI ,  Ken SHIMIZU ,  Emma DOHNER

IPC分类号： H01L27/15 ,  H01L33/50 ,  H01L33/60

摘要： Pixelated array light emitters are formed with closely-spaced pixels having ultra-smooth sidewalls. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.

公开(公告)号：US20200212270A1

公开(公告)日：2020-07-02

申请号：US16232884

申请日：2018-12-26

申请人： Lumileds Holding B.V.

发明人： Marcel Rene BOHMER ,  Jacques Heuts ,  Ken SHIMIZU ,  Peter SCHMIDT

IPC分类号： H01L33/50 ,  H01L25/075 ,  H01L33/60

摘要： A method of fabricating closely spaced pcLEDs arranged in a matrix array of perpendicular rows and columns comprises an initial phosphor deposition step in which phosphor is deposited at alternating locations (pixels) in the matrix array in a checkerboard pattern, so that the locations in the array at which phosphor is deposited are not adjacent to each other. In a subsequent phosphor deposition step phosphor is deposited at the alternating locations at which phosphor was not deposited in the first deposition step. In between the two phosphor deposition steps, reflective or scattering structures may be fabricated on sidewalls of the phosphor pixels to optically isolate pcLEDs in the resulting array from each other.