公开(公告)号：US12037671B2

公开(公告)日：2024-07-16

申请号：US17603187

申请日：2020-04-09

Applicant: MATERION CORPORATION

Inventor： Carole L. Trybus ,  John C. Kuli, Jr. ,  Christopher J. Taylor

IPC: C22F1/08 ,  C21D8/02 ,  C22C9/00

CPC classification number: C22F1/08 ,  C21D8/0236 ,  C21D8/0273 ,  C22C9/00

Abstract: A copper alloy that is devoid of beryllium and has a 0.2% offset yield strength of at least 70 ksi and an electrical conductivity of at least 75% IACS is disclosed. The copper alloy comprises chromium, silicon, silver, titanium, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used in several different applications.