公开(公告)号：US20230207499A1

公开(公告)日：2023-06-29

申请号：US18067221

申请日：2022-12-16

Applicant: MEDIATEK INC.

Inventor： Wun-Jian LIN ,  Shih-Huang YEH ,  Chen-Hao HSU

IPC: H01L23/66 ,  H01L23/498 ,  H01Q1/42 ,  H01Q1/22

CPC classification number: H01L23/66 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49833 ,  H01Q1/422 ,  H01Q1/2283 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L24/16

Abstract: A semiconductor package structure is provided. The structure includes a package substrate having a first surface and a second surface opposite to the first surface and including a ground layer embedded therein. A semiconductor die is formed on the first surface of the package substrate and an antenna pattern layer is formed on the second surface of the package substrate and electrically coupled to the semiconductor die. The structure also includes a first connector and a second connector formed on the second surface of the package substrate and arranged adjacent to the antenna pattern layer. The first connector is electrically coupled to the semiconductor die and electrically isolated to the ground layer, and the second connector is electrically coupled to the ground layer. A wireless communication device including the semiconductor package structure is also provided.