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公开(公告)号：US20240072426A1
公开(公告)日：2024-02-29
申请号：US18453455
申请日：2023-08-22
Applicant: MEDIATEK INC.
Inventor： Nai-Chen LIU , Chung-Hsin CHIANG , Wun-Jian LIN , Shih-Huang YEH
CPC classification number: H01Q1/36 , H01Q1/125 , H01Q1/46 , H01Q21/062
Abstract: An antenna and an electronic device including the antenna are provided. The antenna includes a pair of radiators, a pair of feeding elements, first and second feeding ports. The radiators are located beside a geometric origin and separated from each other. The geometric origin is located between the radiators. The feeding elements are located below the pair of radiators and are configured to feed signals to the radiators. The pair of feeding elements includes a first feeding element and a second feeding element that are separated from each other. The first feeding element has a first geometric configuration. The second feeding element has a second geometric configuration that is asymmetric to the first geometric configuration. The first feeding port is electrically connected to the first feeding element. The second feeding port is separated from the first feeding port and electrically connected to the second feeding element.
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公开(公告)号：US20240039165A1
公开(公告)日：2024-02-01
申请号：US18344113
申请日：2023-06-29
Applicant: MEDIATEK INC.
Inventor： Hsuan-Jui CHANG , Nai-Chen LIU , Shih-Huang YEH , Chung-Hsin CHIANG , Wun-Jian LIN
Abstract: An antenna is provided. The antenna includes a first radiator and a second radiator. The first radiator includes a first section and a second section. The first section includes a first grounding edge and a first bending edge. The second section is connected to the first bending edge. The first grounding edge is grounded. The first section is not parallel to the second section. A first slot is formed on the first section. The second radiator includes a third section and a fourth section. The third section includes a second grounding edge and a second bending edge. The fourth section is connected to the second bending edge. The second grounding edge is grounded. The third section is not parallel to the fourth section. The first section is parallel to the third section.
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公开(公告)号：US20230268656A1
公开(公告)日：2023-08-24
申请号：US18162007
申请日：2023-01-31
Applicant: MEDIATEK INC.
Inventor： Chung-Hsin CHIANG , Nai-Chen LIU , Shih-Huang YEH
Abstract: An antenna is provided. The antenna includes a first radiator positioned at a first level and connected to a ground plane at a second level. In a top view, the first radiator has a first edge, a second edge, a third edge, a fourth edge and a first arc edge. The second edge and the third edge are connected to opposite ends of the first edge. The fourth edge is connected to an end of the third edge opposite to the first edge. The first arc edge with a first radius has opposite ends respectively connected to the second edge and the fourth edge. The first arc edge has a first arc length corresponding to a first central angle, which is less than 90 degrees.
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公开(公告)号：US20220368003A1
公开(公告)日：2022-11-17
申请号：US17721701
申请日：2022-04-15
Applicant: MEDIATEK Inc.
Inventor： Chung-Hsin CHIANG , Yeh-Chun KAO , Shih-Huang YEH
Abstract: An antenna module includes a first dielectric layer, an antenna layer, an electronic element and a first antenna tuning element. The first dielectric layer has an first dielectric surface and a second dielectric surface opposite to the first dielectric surface in a thickness direction. The antenna layer is formed in the first dielectric layer or formed on the first dielectric surface. The electronic element is disposed near to the second dielectric surface than to the first dielectric surface. The first antenna tuning element is formed on one of the first dielectric surface and the second dielectric surface and connected to the antenna layer. The first antenna tuning element and the electronic element are disposed in the thickness direction.
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公开(公告)号：US20220131262A1
公开(公告)日：2022-04-28
申请号：US17489900
申请日：2021-09-30
Applicant: MEDIATEK Inc.
Inventor： Chung-Hsin CHIANG , Li-Yu CHEN , Shih-Huang YEH
Abstract: An antenna module includes a first dielectric layer, an antenna layer, a grounding layer and a conductive layer. The first dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface and a first dielectric lateral surface extending between the first dielectric surface and the second dielectric surface. The antenna layer is formed on the first dielectric surface. The grounding layer is formed below the second dielectric surface. The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the antenna layer but not contacts the first dielectric surface.
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Patent Agency Ranking
公开(公告)号：US20250038412A1
公开(公告)日：2025-01-30
申请号：US18547211
申请日：2023-04-23
Applicant: MEDIATEK INC.
Inventor： Nai-Chen LIU , Shih-Huang YEH , Chung-Hsin CHIANG , Wun-Jian LIN
Abstract: A semiconductor package is provided. The semiconductor package includes a first passive component module, a first antenna module, a first conductive structure and a second conductive structure. The first passive component module has a top surface, a bottom surface and a first side surface between the top surface and the bottom surface. The passive component module has a first size. The first antenna module is separated from the first passive component module and stacked on the top surface of the first passive component module. The antenna module has a second size. The first conductive structure is in contact with the top surface of the first passive component module and electrically connected to the first antenna module. The second conductive structure is in contact with the bottom surface of the first passive component module.
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公开(公告)号：US20250023226A1
公开(公告)日：2025-01-16
申请号：US18735547
申请日：2024-06-06
Applicant: MEDIATEK Inc.
Inventor： Chih-Hsiang LIU , Shih-Huang YEH
Abstract: An antenna device includes an antenna substrate and a semiconductor package. The antenna substrate includes a base and an input pad, wherein the base has a first surface, and the input pad is disposed on a first portion of the first surface. The semiconductor package is disposed on the first surface of the semiconductor package. The semiconductor package has a second surface facing the first surface, and an entirety of the second surface and a second portion of the first surface overlap.
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公开(公告)号：US20240088561A1
公开(公告)日：2024-03-14
申请号：US18457543
申请日：2023-08-29
Applicant: MEDIATEK INC.
Inventor： Yen-Ju LIN , Chung-Hsin CHIANG , Wun-Jian LIN , Shih-Huang YEH
Abstract: An antenna structure is provided. The antenna structure includes a first metal layer and a second metal layer disposed over the first metal layer. The second metal layer forms a first antenna resonating element operating at a first band and has a first opening. The antenna structure also includes a third metal layer disposed over the second metal layer. The third metal layer forms a second antenna resonating element operating at a second band, which is different from the first band. The antenna structure further includes a first transmission line extending from the first metal layer to the second metal layer and a second transmission line extending from the first metal layer through the first opening to the third metal layer.
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公开(公告)号：US20240413536A1
公开(公告)日：2024-12-12
申请号：US18673436
申请日：2024-05-24
Applicant: MEDIATEK INC.
Inventor： Chih-Hsiang LIU , Chung-Hsin CHIANG , Shih-Huang YEH
Abstract: An antenna and an antenna package are provided. The antenna includes an antenna substrate, an antenna layer, a grounding layer and a first conductive feature. The antenna substrate has a top surface and a bottom surface opposite to the top surface. The antenna layer is disposed on the top surface of the antenna substrate. The grounding layer is disposed on the bottom surface of the antenna substrate. The first conductive feature is embedded in the antenna substrate and close to a first edge of the antenna layer. The first conductive feature and the grounding layer are spaced apart by a part of the antenna substrate. The first conductive feature includes a first portion. The angle between the first portion or an extended line of the first portion and the top surface of the antenna substrate is greater than 0 degrees and less than 180 degrees.
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公开(公告)号：US20220384966A1
公开(公告)日：2022-12-01
申请号：US17838425
申请日：2022-06-13
Applicant: MEDIATEK Inc.
Inventor： Chung-Hsin CHIANG , Li-Yu CHEN , Shih-Huang YEH
Abstract: An antenna for multi-broadband and multi-polarization communication, may include a plurality of radiators configured to jointly function as one or more dipoles, a first feed terminal for a first signal of a first polarization, and a second feed terminal for a second signal of a second polarization different from the first polarization. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands. In an embodiment, the antenna may further include a third feed terminal for a third signal of the first polarization, and a fourth feed terminal for a fourth signal of the second polarization.
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