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18 条记录 (耗时 0.012 秒)

    SEMICONDUCTOR DEVICE WITH AN EM-INTEGRATED DAMPER
    2.
    发明申请
    SEMICONDUCTOR DEVICE WITH AN EM-INTEGRATED DAMPER 审中-公开

    公开(公告)号：US20200051925A1

    公开(公告)日：2020-02-13

    申请号：US16526632

    申请日：2019-07-30

    申请人： MediaTek Inc.

    发明人： Yi-Chieh Lin ,  Sheng-Mou Lin ,  Wen-Chou Wu

    IPC分类号： H01L23/552 ,  H01L23/498 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02

    摘要： A semiconductor device includes a first layer structure, a first layer structure, a second layer structure and a passive electronic component. The second layer structure is disposed below the first layer structure and coupled to a ground. The conductive structure is coupled to the first layer structure. The conductive structure is installed vertically between the first layer structure and the second layer structure, and is coupled to a first pad of the second layer structure. The passive electronic component comprises a first terminal coupled to the first pad of the second layer structure and a second terminal coupled to a second pad of the second layer structure. The conductive structure and the passive electronic component are connected in series between the first layer structure and the ground to form a conductive path for conducting at least one electromagnetic interference signal to the ground.

    PACKAGE-LEVEL ESD PROTECTION
    4.
    发明申请
    PACKAGE-LEVEL ESD PROTECTION 有权

    公开(公告)号：US20230138324A1

    公开(公告)日：2023-05-04

    申请号：US17902912

    申请日：2022-09-05

    申请人： MEDIATEK INC.

    发明人： Yu-Cheng Liao ,  Bo-Shih Huang ,  Che-Yuan Jao ,  Yi-Chieh Lin

    IPC分类号： H01L23/60 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

    摘要： The present invention provides a package including a first pad, a die and at least one package ESD component is disclosed. The first pad is configured to receive a signal from a device external to the package. The die comprises a second pad and an internal circuit, wherein the internal circuit is configured to receive the signal from the first pad via the second pad. The at least one ESD component is positioned outside the die.

    Filter circuits
    9.
    发明授权
    Filter circuits 有权

    公开(公告)号：US11682816B2

    公开(公告)日：2023-06-20

    申请号：US16940379

    申请日：2020-07-27

    申请人： MEDIATEK INC.

    发明人： Yi-Chieh Lin ,  Shih-Chia Chiu

    IPC分类号： H01P1/203 ,  H01P7/08 ,  H01F27/28 ,  H01F27/29 ,  H03H7/01 ,  H05K1/16

    CPC分类号： H01P1/20345 ,  H01F27/2804 ,  H01F27/29 ,  H01P1/20327 ,  H01P1/20381 ,  H01P7/08 ,  H03H7/0138 ,  H05K1/165

    摘要： A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.