Abstract:
A semiconductor package including at least one functional die; at least one dummy die free of active circuit, wherein the dummy die comprises at least one metal-insulator-metal (MIM) capacitor; and a redistribution layer (RDL) structure interconnecting the MIM capacitor to the at least one functional die.
Abstract:
A semiconductor package including at least one functional die; at least one dummy die free of active circuit, wherein the dummy die comprises at least one metal-insulator-metal (MIM) capacitor; and a redistribution layer (RDL) structure interconnecting the MIM capacitor to the at least one functional die.
Abstract:
A semiconductor package including at least one functional die; at least one dummy die free of active circuit, wherein the dummy die comprises at least one metal-insulator-metal (MIM) capacitor; and a redistribution layer (RDL) structure interconnecting the MIM capacitor to the at least one functional die.
Abstract:
A depth processing method and associated graphic processing circuit is provided. The method comprises loading geometry data of a scene and performing a vertex transformation thereof. After the geometry data is segmented in a tile resolution, pre-depth data of the scene are obtained. After the geometry data are segmented in a bin resolution, plural bin tables are generated. Then, the plural bin tables are converted into plural tiles, the plural converted tiles are classified into a first portion of tiles and a second portion of tiles according to depth data of the converted tiles and the pre-depth data of the scene, and the second portion of tiles are discarded. After the first portion of tiles are processed, a color value and a depth value of each pixel of the scene are generated.
Abstract:
A graphic processing circuit with binning rendering and associated pre-depth processing method is provided. Firstly, a first depth data of a first primitive corresponding to a specified tile is received. Then, the pre-depth data corresponding to the specified tile is read from a pre-Z buffer. If the first depth data is not larger than the pre-depth data and the first primitive is an opaque primitive, the pre-depth data is updated with the first depth data. If the first depth data is not larger than the pre-depth data and the first primitive is a translucent primitive, an uncertainty ordering range is defined according to the first depth data and the pre-depth data, and the pre-depth data is updated with the uncertainty ordering range.
Abstract:
A depth processing method and associated graphic processing circuit is provided. The method comprises loading geometry data of a scene and performing a vertex transformation thereof. After the geometry data is segmented in a tile resolution, pre-depth data of the scene are obtained. After the geometry data are segmented in a bin resolution, plural bin tables are generated. Then, the plural bin tables are converted into plural tiles, the plural converted tiles are classified into a first portion of tiles and a second portion of tiles according to depth data of the converted tiles and the pre-depth data of the scene, and the second portion of tiles are discarded. After the first portion of tiles are processed, a color value and a depth value of each pixel of the scene are generated.
Abstract:
A graphic processing circuit with binning rendering and associated pre-depth processing method is provided. Firstly, a first depth data of a first primitive corresponding to a specified tile is received. Then, the pre-depth data corresponding to the specified tile is read from a pre-Z buffer. If the first depth data is not larger than the pre-depth data and the first primitive is an opaque primitive, the pre-depth data is updated with the first depth data. If the first depth data is not larger than the pre-depth data and the first primitive is a translucent primitive, an uncertainty ordering range is defined according to the first depth data and the pre-depth data, and the pre-depth data is updated with the uncertainty ordering range.