公开(公告)号：US20230253390A1

公开(公告)日：2023-08-10

申请号：US18154413

申请日：2023-01-13

Applicant: MEDIATEK INC.

Inventor： Ruey-Bo SUN ,  Chih-Chun HSU ,  Sheng-Mou LIN

IPC: H01L25/18 ,  H01L23/552 ,  H01L23/522 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L25/18 ,  H01L23/552 ,  H01L23/5227 ,  H01L23/49822 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/0657 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/48227 ,  H01L2225/06562 ,  H01L2225/0651 ,  H01L2224/32145 ,  H01L2224/73265 ,  H01L2224/32225

Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes a base, a first system-on-chip (SOC) die, a conductive routing and a first shielding film. The first SOC die is disposed on the base. The first SOC die has a front surface and a back surface. The first SOC die includes a first inductor close to the front surface. The conductive routing is disposed on the back surface of the first SOC die. The first shielding film is disposed between the first SOC die and the conductive routing. The first shielding film covers the back surface of the first SOC die and fully overlaps the first inductor.