公开(公告)号：US20240274518A1

公开(公告)日：2024-08-15

申请号：US18645786

申请日：2024-04-25

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung LIN ,  Yuan-Chin LIU

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49816 ,  H01L23/3192 ,  H01L24/13 ,  H01L24/45 ,  H01L24/73 ,  H01L25/0655

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first substrate having a first wiring structure; and a second substrate having a second wiring structure, wherein the first substrate and the second substrate are arranged side-by-side, and the first substrate and the second substrate are surrounded and separated by a molding material. The semiconductor package structure also includes a redistribution layer disposed over the first substrate and the second substrate, wherein the redistribution layer is electrically coupled to the first wiring structure and the second wiring structure; and a frame surrounding the first substrate and the second substrate.

公开(公告)号：US20220310498A1

公开(公告)日：2022-09-29

申请号：US17838412

申请日：2022-06-13

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung LIN ,  Yuan-Chin LIU

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a first semiconductor die, and a second semiconductor die. The substrate includes a first substrate partition and a second substrate partition. The first substrate partition has a first wiring structure. The second substrate partition is adjacent to the first substrate partition and has a second wiring structure. The first substrate partition and the second substrate partition are surrounded by a first molding material. The first semiconductor die is disposed over the substrate and electrically coupled to the first wiring structure. The second semiconductor die is disposed over the substrate and electrically coupled to the second wiring structure.

公开(公告)号：US20200211944A1

公开(公告)日：2020-07-02

申请号：US16813898

申请日：2020-03-10

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung LIN ,  Yuan-Chin LIU

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a first semiconductor die, and a second semiconductor die. The substrate includes a first substrate partition and a second substrate partition. The first substrate partition has a first wiring structure. The second substrate partition is adjacent to the first substrate partition and has a second wiring structure. The first substrate partition and the second substrate partition are surrounded by a first molding material. The first semiconductor die is disposed over the substrate and electrically coupled to the first wiring structure. The second semiconductor die is disposed over the substrate and electrically coupled to the second wiring structure.