公开(公告)号：US20240413536A1

公开(公告)日：2024-12-12

申请号：US18673436

申请日：2024-05-24

Applicant: MEDIATEK INC.

Inventor： Chih-Hsiang LIU ,  Chung-Hsin CHIANG ,  Shih-Huang YEH

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/48

Abstract: An antenna and an antenna package are provided. The antenna includes an antenna substrate, an antenna layer, a grounding layer and a first conductive feature. The antenna substrate has a top surface and a bottom surface opposite to the top surface. The antenna layer is disposed on the top surface of the antenna substrate. The grounding layer is disposed on the bottom surface of the antenna substrate. The first conductive feature is embedded in the antenna substrate and close to a first edge of the antenna layer. The first conductive feature and the grounding layer are spaced apart by a part of the antenna substrate. The first conductive feature includes a first portion. The angle between the first portion or an extended line of the first portion and the top surface of the antenna substrate is greater than 0 degrees and less than 180 degrees.

公开(公告)号：US20250023226A1

公开(公告)日：2025-01-16

申请号：US18735547

申请日：2024-06-06

Applicant: MEDIATEK Inc.

Inventor： Chih-Hsiang LIU ,  Shih-Huang YEH

IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q1/50

Abstract: An antenna device includes an antenna substrate and a semiconductor package. The antenna substrate includes a base and an input pad, wherein the base has a first surface, and the input pad is disposed on a first portion of the first surface. The semiconductor package is disposed on the first surface of the semiconductor package. The semiconductor package has a second surface facing the first surface, and an entirety of the second surface and a second portion of the first surface overlap.